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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
2
Effect of Tg and modulus on the underfill reliability in pa..:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
4
Effect of Silane Coupling Agents on the Underfill Adhesion ..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
5
Effects of Temperature on the Adhesive Performance of High ..:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
6
Study on the Hygrothermal Reliability of Underfill/Passivat..:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
8
Enhancement of Interfacial Adhesion in Underfill/Silicon fo..:
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2021 22nd International Conference on Electronic Packaging Technology (ICEPT) ,
11