Lin, Jenn-Ming
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3

Hybrid Surface Treatment for Copper-to-Copper Thermal Compr..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
 
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5

Electrochemical analysis of initial oxide layers on copper ..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Lin, Chi-Hsuan ; Chen, Wei-Ting ; Ke, Yu-Cheng.. - p. 163-164 , 2022
 
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Factors associated with treatment outcomes after intravesic..:

Tsai, Ching-Pei ; Yang, Jenn-Ming ; Liang, So-Jung...
Journal of the Chinese Medical Association.  84 (2021)  4 - p. 418-422 , 2021
 
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13

Ultrahigh density plasmonic hot spots with ultrahigh electr..:

Yang, Tung-Han ; Harn, Yeu-Wei ; Pan, Ming-Yang...
Applied Catalysis B: Environmental.  181 (2016)  - p. 612-624 , 2016
 
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15

Productivity growth, scale economies, ship size economies a..:

Wu, Wei-Ming ; Lin, Jenn-Rong
Transportation Research Part E: Logistics and Transportation Review.  73 (2015)  - p. 1-16 , 2015
 
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