Lin, Nien-Chun
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1

Semiconductor Fan-Out Polymer Adhesion on Physical Vapor De..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Lin, Nien-Chun ; Shih, Hsin-Chih ; Tsai, Ching-I... - p. 179-180 , 2024
 
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2

Therapeutic Potential of a Novel Lytic Phage, vB_EclM_ECLFM..:

Ali, Saieeda Fabia ; Teh, Soon-Hian ; Yang, Hsueh-Hui...
International Journal of Molecular Sciences.  25 (2024)  2 - p. 854 , 2024
 
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4

Occurrence and surveillance of Taiwanese bovine arboviruses..:

Tzeng, Hau-You ; Ting, Lu-Jen ; Chiu, Chin-Ing...
Journal of Medical Entomology.  60 (2023)  5 - p. 1117-1123 , 2023
 
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8

Nitrosylation of the Diiron Core Mediated by the N Domain o..:

Tsai, Ruei-Fong ; Lin, Nien-Chen ; Kao, Te-Yu...
The Journal of Physical Chemistry Letters.  11 (2020)  20 - p. 8538-8542 , 2020
 
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10

Maxillary Bone Epithelial Cyst in an Adult Miniature Schnau..:

LIN, Chung-Tien ; TASI, Wen-Chih ; HU, Chun-Kun...
Journal of Veterinary Medical Science.  70 (2008)  9 - p. 1001-1004 , 2008
 
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11

Switching Noise Analysis for Conducted Electromagnetic Inte..:

, In: 2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC),
Lin, Han-Nien ; Ho, Tzu-Hao ; Ko, Po-Ning... - p. 1-4 , 2021
 
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13

EFT Transient Noise Model and Protection Analysis from Chip..:

, In: 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE,
Lin, Han-Nien ; Ho, Tzu-Hao ; Huang, Yu-Chun... - p. 1-4 , 2020
 
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14

Analysis of PCB return path configuration effect on Transie..:

, In: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC),
Lin, Han-Nien ; Huang, Jia-Yu ; Huang, Yu-Chun... - p. 214-217 , 2019
 
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