E-LIB Suche - Ergebnisse für: Lin, Paul-Chang

1

Effective Approach for TSV Cu Plating Gap Fill Improvement:

Lin, Paul-Chang ; Li, Guang-Ning ; Jiang, Jian-Yong...
ECS Transactions. 52 (2013) 1 - p. 443-451 , 2013

Link: https://doi.org/10.1149/..

2

Fab Environment Effect on Crescent Pits Defect in Cu Metall..:

Kang, Xiao-Chun ; Lin, Paul-Chang ; He, Peng...
ECS Transactions. 44 (2012) 1 - p. 797-801 , 2012

Link: https://doi.org/10.1149/..

3

Effective Approach for Hillock Defect Reduction in Cu Metal..:

Li, Guang-Ning ; Lin, Paul-Chang ; Jiang, Jian-Yong...
ECS Transactions. 44 (2012) 1 - p. 737-743 , 2012

Link: https://doi.org/10.1149/..

4

Study on Defect Reduction and Yield Improvement of MIM Al D..:

Chang, Vincent ; Gu, Athics ; Li, Terry...
ECS Transactions. 44 (2012) 1 - p. 791-796 , 2012

Link: https://doi.org/10.1149/..

5

Study on Al-Ge Bonding and Quality Improvement in CMEMS Pro..:

Gu, Athics ; Lin, Paul-Chang ; Chang, Vincent...
ECS Transactions. 44 (2012) 1 - p. 1393-1399 , 2012

Link: https://doi.org/10.1149/..

6

CMP Slurry and Process Development for TSV Front-Side Polis..:

Xu, Jinhai ; Lin, Paul-Chang ; Li, Pei...
ECS Transactions. 44 (2012) 1 - p. 537-542 , 2012

Link: https://doi.org/10.1149/..

7

Wafer Backside Arcing Prevention in SIP Ti/TiN Process:

Huang, Hupin ; Lin, Paul-Chang ; Gui, Kun...
ECS Transactions. 44 (2012) 1 - p. 505-509 , 2012

Link: https://doi.org/10.1149/..

8

Study on the Solution of via Bottom Void in 90nm Technology:

Zhou, Dong-Yi ; He, Peng ; Sun, Ri-Hui...
ECS Transactions. 44 (2012) 1 - p. 745-749 , 2012

Link: https://doi.org/10.1149/..

9

Investigation of Mechanical Effects on Advanced Copper CMP:

Jing, Jianfen ; Ma, Zhiyong ; Lin, Paul-Chang...
ECS Transactions. 27 (2010) 1 - p. 593-598 , 2010

Link: https://doi.org/10.1149/..

10

Wafer Sticking Reduction and MTBF Improvement in AlCu Sputt..:

Wang, Xuan ; Li, Xiu-jun ; Li, Xia...
ECS Transactions. 27 (2010) 1 - p. 779-783 , 2010

Link: https://doi.org/10.1149/..

11

Crown Defect Reduction and Cp Yield Improvement for High Vo..:

Zhang, Guan-Qun ; Gu, Athics ; Lin, Yi-Hui...
ECS Transactions. 27 (2010) 1 - p. 377-382 , 2010

Link: https://doi.org/10.1149/..

12

Study on Effects of Slurry Key Factors on Advanced Oxide CM..:

Song, Peter ; Yao, Daisy ; Lee, Leo...
ECS Transactions. 27 (2010) 1 - p. 557-562 , 2010

Link: https://doi.org/10.1149/..

13

Effective approaches to prevent ambient contaminations impa..:

, In: 2010 International Workshop on Junction Technology Extended Abstracts,

Kun-Gui ; Lin, Paul-Chang ; Ouyang, Dong.. - p. 1-3 , 2010

Link: https://doi.org/10.1109/..

14

Mechanism and Solution of Isb Failure on Deep Trench DRAM:

Li, Zhi-Chao ; Mo, Ting-Ting ; Lin, Yi-Hui...
ECS Transactions. 27 (2010) 1 - p. 371-375 , 2010

Link: https://doi.org/10.1149/..

15

Novel Approach for W Loss Defect Prevention on WCMP Re-Clea..:

Zhang, Jian ; Wang, Zhe ; Wen, Jing...
ECS Transactions. 27 (2010) 1 - p. 545-549 , 2010

Link: https://doi.org/10.1149/..