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Lin, Pengrong
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1

Improvement of PbSn Solder Reliability with Ge Microalloyin..:

Qu, Zhibo ; Hao, Yilong ; Chen, Changhao...
Materials.  17 (2024)  3 - p. 724 , 2024
Link: https://doi.org/10.3390/..
 
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2

Transient liquid phase bonding of Sn-Pb solder with added C..:

Wang, Jiaxing ; Lin, Pengrong ; Yao, Quanbin...
Journal of Physics: Conference Series.  2671 (2024)  1 - p. 012022 , 2024
Link: https://doi.org/10.1088/..
 
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3

Improved shear property of Sn-3.0Ag-0.5Cu/Ni micro solder j..:

Tian, Ruyu ; Gao, Yan ; Wen, Jiayue...
Journal of Materials Research and Technology.  29 (2024)  - p. 5034-5047 , 2024
Link: https://doi.org/10.1016/..
 
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4

U2D2PCB: Uncertainty-Aware Unsupervised Defect Detection on..:

Chen, Changlin ; Wu, Qiman ; Zhang, Jin...
IEEE Transactions on Instrumentation and Measurement.  73 (2024)  - p. 1-10 , 2024
Link: https://doi.org/10.1109/..
 
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5

Study on the 12 in. wafer uniformity of high aspect ratio T..:

Zhang, Chi ; Zeng, Guoxian ; Lin, Pengrong...
Microelectronic Engineering.  292 (2024)  - p. 112181 , 2024
Link: https://doi.org/10.1016/..
 
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6

Microstructural evolution of joints with and without Sb, Ni..:

Wu, Xuefeng ; Hou, Zhuangzhuang ; Xie, Xiaochen...
Journal of Materials Research and Technology.  26 (2023)  - p. 1382-1396 , 2023
Link: https://doi.org/10.1016/..
 
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7

Experimental Investigations on Thermal Superposition Effect..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Ye, Yuxin ; Du, Xiangbin ; Kong, Yanmei... - p. 1017-1021 , 2023
Link: https://doi.org/10.1109/..
 
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8

Achieving high-quality silver sintered joint for highly-rel..:

Dai, Chenyi ; Wang, Yong ; Lin, Pengrong...
Frontiers in Materials.  10 (2023)  - p. , 2023
Link: https://doi.org/10.3389/..
 
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9

Effect of insulating material and structure on the reliabil..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Li, Zongyang ; Yao, Quanbin ; Lin, Pengrong... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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10

Study of flip ultrasonic bonding process with Non-conductiv..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Liu, Haoming ; Guo, Hengtong ; Xu, Shimeng... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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11

Study on mechanical properties and microstructure reliabili..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wang, Jiaxing ; Zhang, Long ; Yao, Quanbin... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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12

Hand Operation Ergonomics Study and Design of CCGA Grinding..:

, In: Man-Machine-Environment System Engineering; Lecture Notes in Electrical Engineering,
Liu, Haoting ; Ge, Jianyue ; Wang, Yuan... - p. 719-725 , 2022
Link: https://doi.org/10.1007/..
 
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13

Facial Action Unit Detection by Exploring the Weak Relation..:

, In: Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering; Collaborative Computing: Networking, Applications and Worksharing,
Tian, Mengke ; Zhu, Hengliang ; Wang, Yong... - p. 478-495 , 2022
Link: https://doi.org/10.1007/..
 
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14

Simulation analysis of a specification package for high den..:

Cai, Jiawei ; Zhang, Long ; Huang, Yingzhuo..
Journal of Physics: Conference Series.  2383 (2022)  1 - p. 012093 , 2022
Link: https://doi.org/10.1088/..
 
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15

Transient liquid phase bonding of Sn-Pb solder with added N..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Wang, Jiaxing ; Yao, Quanbin ; Lin, Pengrong... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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