Lin, Sih-Tung
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1

Creep Viscoplastic Characterization of SAC Solders Exposed ..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Liu, Vance ; Lin, Sih-Tung ; Chang, Esan.. - p. 1-4 , 2023
 
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4

A cost-effective transperineal prostate biopsy method utili..:

Wu, Richard C. ; Tung, Mu-Chaio ; Wu, Chun-Hsien...
International Urology and Nephrology.  55 (2023)  11 - p. 2695-2701 , 2023
 
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