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Lin, Youle
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1

Semiconductor Package Design Flow and Platform Applied on F..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Lin, Youle ; Chang, Keng-Tuan ; Kuo, Hung-Chun.. - p. 21-22 , 2023
Link: https://doi.org/10.23919..
 
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2

Microstructure optimization of fuel electrodes for high‐eff..:

Bi, Susu ; Ye, Chencheng ; Liu, Youle...
Journal of the American Ceramic Society.  , 2023
Link: https://doi.org/10.1111/..
 
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3

Characterization of the Mechanism of Cellular and Cell Free..:

Lin, J.J. ; Newton, D.L. ; Mikulski, S.M....
Biochemical and Biophysical Research Communications.  204 (1994)  1 - p. 156-162 , 1994
Link: https://doi.org/10.1006/..
 
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