Lin, Yumin
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1

Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding w..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Ou-Hsiang ; Chiu, Wei-Lan ; Chang, Hsiang-Hung... - p. 1863-1867 , 2024
 
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Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer B..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
 
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Low Temperature (250°C) and Fine Pitch (≤4 μ m) New Nanocry..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Lin, Ang-Ying ; Lin, Yu-Min ; Lu, Chun-Lin... - p. 1-2 , 2024
 
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6

Chinese License Plate Recognition System Based on Convoluti..:

Chen, Hongru ; Lin, Yumin ; Zhao, Tianhao
Highlights in Science, Engineering and Technology.  34 (2023)  - p. 95-102 , 2023
 
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7

White-light-emitting diodes based on blue and green quantum..:

Chang, Che-Yu ; Mahesh, K. P. O. ; Chen, Ting-Qing...
Journal of Materials Chemistry C.  11 (2023)  22 - p. 7311-7319 , 2023
 
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8

Negative-Tone Photosensitive Polymeric Bonding Material to ..:

Lee, Chia-Hsin ; Tan, Chung-An ; Fowler, Michelle...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  8 - p. 1316-1323 , 2023
 
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11

D-Mode GaN HEMT with Direct Drive:

, In: 2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia),
 
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12

A Novel Polymer-Based Ultra-High Density Bonding Interconne..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Lin, Yu-Min ; Yang, Tsung-Yu Ou ; Lee, Ou-Hsiang... - p. 1779-1784 , 2023
 
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13

Optical Microphone-Based Speech Reconstruction System With ..:

Lin, Yu-Min ; Han, Ji-Yan ; Lin, Cheng-Hung.
IEEE Transactions on Biomedical Engineering.  70 (2023)  12 - p. 3330-3341 , 2023
 
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14

Identification of Adipogenesis Subgroups and Immune Infiltr..:

Lin, Yumin ; Qu, Liyuan ; Wu, Jintao...
Journal of Immunology Research.  2023 (2023)  - p. 1-15 , 2023
 
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15

Characteristic Analysis of a Multi-chip Embedded Interposer..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Lee, Ching Kuan ; Liu, Wen-Hung ; Chang, Shu-Yi... - p. 55-56 , 2022
 
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