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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding w..:
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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
3
Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer B..:
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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
5
Low Temperature (250°C) and Fine Pitch (≤4 μ m) New Nanocry..:
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2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia) ,
11
D-Mode GaN HEMT with Direct Drive:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
12
A Novel Polymer-Based Ultra-High Density Bonding Interconne..:
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2022 International Conference on Electronics Packaging (ICEP) ,
15