E-LIB Suche - Ergebnisse für: Lin, Zhongkang

1

Current Measurement Method of Multiple Chips Using Rectangu..:

Fu, Shi ; Li, Xuebao ; Lin, Zhongkang...
IEEE Transactions on Power Electronics. 38 (2023) 1 - p. 96-100 , 2023

Link: https://doi.org/10.1109/..

2

Frequency Characteristics Analysis of Improved Square PCB R..:

, In: 2022 3rd International Conference on Electronic Communication and Artificial Intelligence (IWECAI),

Dai, Anqi ; Lin, Zhongkang ; Sun, Shuai... - p. 116-120 , 2022

Link: https://doi.org/10.1109/..

3

Optimal synthesis of four-bar linkages for path generation ..:

Yao, Xinyuan ; Wang, Xingdong ; Sun, Wei..
Mechanical Sciences. 13 (2022) 1 - p. 79-87 , 2022

Link: https://doi.org/10.5194/..

4

Semantic segmentation network with multi-path structure, at..:

Lin, Zhongkang ; Sun, Wei ; Tang, Bo...
The Visual Computer. , 2022

Link: https://doi.org/10.1007/..

5

The Effect of the Surface Roughness Characteristics of the ..:

An, Tong ; Li, Zezheng ; Zhang, Yakun...
IEEE Transactions on Power Electronics. 37 (2022) 6 - p. 7286-7298 , 2022

Link: https://doi.org/10.1109/..

6

The piezoelectricity of 2D Janus ZnBrI: Multiscale predicti..:

Wang, Liang ; Lin, Zhongkang ; Du, Yujie...
Chemical Physics Letters. 794 (2022) - p. 139506 , 2022

Link: https://doi.org/10.1016/..

7

Review of surface defect detection of steel products based ..:

Tang, Bo ; Chen, Li ; Sun, Wei.
IET Image Processing. 17 (2022) 2 - p. 303-322 , 2022

Link: https://doi.org/10.1049/..

8

The Impact of Different Operation Conditions on the Plasma ..:

Tang, Xinling ; Zhang, Xizi ; Lin, Zhongkang..
Journal of Physics: Conference Series. 2030 (2021) 1 - p. 012026 , 2021

Link: https://doi.org/10.1088/..

9

Impact of Turns Number of Square PCB Rogowski Coil for Meas..:

, In: 2021 8th International Forum on Electrical Engineering and Automation (IFEEA),

Dai, Anqi ; Zhang, Xizi ; Lin, Zhongkang... - p. 170-174 , 2021

Link: https://doi.org/10.1109/..

10

Properties-enhanced gas sensor based on Cu-doped tellurene ..:

Wang, Liang ; Lin, Zhongkang ; Du, Yujie...
Molecular Physics. 119 (2021) 7 - p. , 2021

Link: https://doi.org/10.1080/..

11

Research on Thermal Impedance Modeling Method of IGBT Devic..:

, In: Proceedings of the 2021 5th International Conference on Electronic Information Technology and Computer Engineering,

Sun, Shuai ; Han, Ronggang ; Lin, Zhongkang - p. 270-275 , 2021

Link: https://dl.acm.org/doi/1..

12

Research status and analysis of the surface insulation of t..:

, In: Proceedings of the 2020 4th International Conference on Electronic Information Technology and Computer Engineering,

Zhang, Xizi ; Tang, Xinling ; Chen, Shu... - p. 1153-1161 , 2020

Link: https://dl.acm.org/doi/1..

13

Electro-thermal finite element analysis of IGBT module unde..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),

Wu, Wei ; Li, Xianbing ; Wang, Liang. - p. 1-6 , 2019

Link: https://doi.org/10.1109/..

14

Stress distribution of bonding wire of IGBT module under DC..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),

Wu, Wei ; Wang, Liang ; Lin, Zhongkang. - p. 1-6 , 2019

Link: https://doi.org/10.1109/..

15

Research on Texture Defect Detection Based on Faster-RCNN a..:

, In: Proceedings of the 2019 11th International Conference on Machine Learning and Computing,

Lin, Zhongkang ; Guo, Zhiqiang ; Yang, Jie - p. 429-433 , 2019

Link: https://dl.acm.org/doi/1..