E-LIB Suche - Ergebnisse für: Litta, Eugenio Dentoni

1

ALD Mo for Advanced MOL Local Interconnects:

, In: 2022 IEEE International Interconnect Technology Conference (IITC),

Hosseini, Maryamsadat ; Tierno, Davide ; Maes, Jan Willem... - p. 145-147 , 2022

Link: https://doi.org/10.1109/..

2

The Low-Frequency Noise Behavior of Advanced Logic and Memo..:

, In: 2022 China Semiconductor Technology International Conference (CSTIC),

Simoen, Eddy ; Ritzenthaler, Romain ; Mertens, Hans... - p. 1-4 , 2022

Link: https://doi.org/10.1109/..

3

Barrierless ALD Molybdenum for Buried Power Rail and Via-to..:

, In: 2022 IEEE International Interconnect Technology Conference (IITC),

Gupta, Anshul ; Maes, Jan Willem ; Jourdan, Nicolas... - p. 58-60 , 2022

Link: https://doi.org/10.1109/..

4

80 nm tall thermally stable cost effective FinFETs for adva..:

Spessot, Alessio ; Ritzenthaler, Romain ; Litta, Eugenio Dentoni...
Japanese Journal of Applied Physics. 60 (2021) SB - p. SBBB06 , 2021

Link: https://doi.org/10.35848..

5

CMOS integration of high-k/metal gate transistors in diffus..:

Litta, Eugenio Dentoni ; Ritzenthaler, Romain ; Schram, Tom...
Japanese Journal of Applied Physics. 57 (2018) 4S - p. 04FB08 , 2018

Link: https://doi.org/10.7567/..

6

Interfacial Layer Engineering Using Thulium Silicate/German..:

Hellström, Per-Erik ; Litta, Eugenio Dentoni ; Östling, Mikael
ECS Transactions. 64 (2014) 6 - p. 249-260 , 2014

Link: https://doi.org/10.1149/..

7

(Invited) Interface Engineering Routes for a Future CMOS Ge..:

Mitrovic, Ivona Z. ; Althobaiti, Mohammed ; Weerakkody, Ayendra Don...
ECS Transactions. 61 (2014) 2 - p. 73-88 , 2014

Link: https://doi.org/10.1149/..

8

High-Deposition-Rate Atomic Layer Deposition of Thulium Oxi..:

Litta, Eugenio Dentoni ; Hellström, Per-Erik ; Henkel, Christoph...
Journal of The Electrochemical Society. 160 (2013) 11 - p. D538-D542 , 2013

Link: https://doi.org/10.1149/..

9

Properties of Selectively Grown Si:P Layers below 500°C for..:

Rosseel, Erik ; Porret, Clement ; Hikavyy, Andriy Yakovitch...
ECS Transactions. 109 (2022) 4 - p. 93-98 , 2022

Link: https://doi.org/10.1149/..

10

(Invited) TmSiO as a CMOS-Compatible High-k Dielectric:

Dentoni Litta, Eugenio ; Hellström, Per-Erik ; Östling, Mikael
ECS Transactions. 72 (2016) 4 - p. 79-89 , 2016

Link: https://doi.org/10.1149/..

11

Electrical characterization of thulium silicate interfacial..:

Dentoni Litta, Eugenio ; Hellström, Per-Erik ; Henkel, Christoph.
Solid-State Electronics. 98 (2014) - p. 20-25 , 2014

Link: https://doi.org/10.1016/..

12

Bilayer Insulator Tunnel Barriers for Graphene-Based Vertic..:

Vaziri, Sam ; Belete, Melkamu ; Litta, Eugenio Dentoni...
http://arxiv.org/abs/1506.08721. , 2015

Link: http://arxiv.org/abs/150..

13

Ultra-thin film and interface analysis of high-k dielectric..:

Primetzhofer, Daniel ; Litta, Eugenio Dentoni ; Hallén, Anders..
http://arxiv.org/abs/1309.0611. , 2013

Link: http://arxiv.org/abs/130..

14

Enhanced Channel Mobility at Sub-nm EOT by Integration of a..:

Eugenio Dentoni Litta ; Per-Erik Hellstrom ; Mikael Ostling
https://ieeexplore.ieee.org/document/7120903/. , 2015

Link: https://doi.org/10.1109/..

15

Integration of thulium silicate for enhanced scalability of..:

Dentoni Litta, Eugenio
TRITA-ICT/MAP AVH, 1653-7610. , 2014

Link: http://urn.kb.se/resolve..