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2024 International Conference on Electronics Packaging (ICEP) ,
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A Special Holding System for Large Package in 3D X-Ray Insp..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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A Novel Detection Applied on Micro Defect in Bump Interface..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
4
Lock-in Thermography judgment for short/leakage/high resist..:
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2022 International Conference on Electronics Packaging (ICEP) ,
5
3D X-Ray Microscope Applied on Fine-Line Inspection of Fan-..:
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2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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