E-LIB Suche - Ergebnisse für: Liu, Guoyou

1

Investigation into Temperature Dependency on Thermal Charac..:

, In: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia),

Wu, Peixin ; Yang, Xin ; Liu, Guoyou.. - p. 4767-4771 , 2024

Link: https://doi.org/10.1109/..

2

Study on hydration process of alkali-activated slag cement ..:

Yu, Shuya ; He, Juan ; Sang, Guochen..
Construction and Building Materials. 413 (2024) - p. 134716 , 2024

Link: https://doi.org/10.1016/..

3

Investigation on reproduction of IGBT die-attach solder deg..:

, In: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia),

Wei, Yilei ; Yang, Xin ; Wu, Xinlong.. - p. 4684-4689 , 2024

Link: https://doi.org/10.1109/..

4

Investigation on foam stability of multi-component composit..:

He, Juan ; Liu, Guoyou ; Sang, Guochen..
Construction and Building Materials. 391 (2023) - p. 131799 , 2023

Link: https://doi.org/10.1016/..

5

A Novel Lumped-Charge Model for Insulated Gate Bipolar Tran..:

Yang, Xin ; Sun, Yifei ; Ding, Yifei.
IEEE Transactions on Power Electronics. 38 (2023) 8 - p. 9717-9730 , 2023

Link: https://doi.org/10.1109/..

6

Failure Mode Classification of IGBT Modules Under Power Cyc..:

Yang, Xin ; Zhang, Yue ; Wu, Xinlong.
IEEE Transactions on Power Electronics. 38 (2023) 12 - p. 16130-16141 , 2023

Link: https://doi.org/10.1109/..

7

Investigation on fatigue mechanism of solder layers in IGBT..:

Zhao, Shihan ; Yang, Xin ; Wu, Xinlong..
Microelectronics Reliability. 141 (2023) - p. 114901 , 2023

Link: https://doi.org/10.1016/..

8

Lifetime Prediction for Lift-off of Bond Wires in IGBTs Usi..:

Yang, Xin ; Ye, Junjie ; Wu, Xinlong...
IEEE Transactions on Power Electronics. 38 (2023) 10 - p. 13099-13110 , 2023

Link: https://doi.org/10.1109/..

9

Investigation for Influence of Parasitic Inductances of Dam..:

, In: 2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS),

Wang, Xiaodi ; Yang, Xin ; Liu, Guoyou - p. 1819-1825 , 2023

Link: https://doi.org/10.1109/..

10

Analysis on characteristic of 3.3‐kV full SiC device and ra..:

Ding, Rongjun ; Dou, Zechun ; Qi, Yu..
IET Power Electronics. 15 (2022) 10 - p. 978-988 , 2022

Link: https://doi.org/10.1049/..

11

Investigation on Excess Carrier Distribution for a Quasi-2D..:

, In: 2022 IEEE International Power Electronics and Application Conference and Exposition (PEAC),

Sun, Yifei ; Yang, Xin ; Ding, Yifei. - p. 1461-1466 , 2022

Link: https://doi.org/10.1109/..

12

Enhancer looping protein LDB1 regulates hepatocyte gene exp..:

Liu, Guoyou ; Wang, Lei ; Wess, Jürgen.
Nucleic Acids Research. 50 (2022) 16 - p. 9195-9211 , 2022

Link: https://doi.org/10.1093/..

13

A Temperature-Dependent Physical Thermal Network Model Incl..:

Heng, Ke ; Yang, Xin ; Wu, Xinlong..
IEEE Transactions on Electron Devices. 69 (2022) 8 - p. 4444-4452 , 2022

Link: https://doi.org/10.1109/..

14

Pelletizing of Iron Ore with High Iron Grade and Low Silico..:

, In: The Minerals, Metals & Materials Series; 12th International Symposium on High-Temperature Metallurgical Processing,

Zhang, Yan ; Qing, Gele ; Tian, Yunqing... - p. 363-372 , 2022

Link: https://doi.org/10.1007/..

15

A Reliable Device Parameter Extraction Scheme for Physics-B..:

Ding, Yifei ; Yang, Xin ; Liu, Guoyou
IEEE Transactions on Electron Devices. 69 (2022) 10 - p. 5689-5697 , 2022

Link: https://doi.org/10.1109/..