E-LIB Suche - Ergebnisse für: Liu, Zhi-quan

1

Manipulating adsorbate configurations in copper electroplat..:

Peng, Zhen-Jia ; Li, Zhe ; Jiao, Yu...
Nano Materials Science. , 2024

Link: https://doi.org/10.1016/..

2

Identification and Evolution of Intermetallic Compounds For..:

Shang, Panju ; Tian, Feifei ; Liu, Zhi-Quan
Metals. 14 (2024) 2 - p. 139 , 2024

Link: https://doi.org/10.3390/..

3

Research Overview on the Electromigration Reliability of Sn..:

Li, Wenjie ; Guo, Liwei ; Li, Dan.
Materials. 17 (2024) 12 - p. 2848 , 2024

Link: https://doi.org/10.3390/..

4

Boosting Li ion kinetics in H–Co3O4@CNT electrode by synerg..:

Zhang, Qi ; Liu, Yinan ; Zheng, Yun...
Journal of Power Sources. 599 (2024) - p. 234234 , 2024

Link: https://doi.org/10.1016/..

5

Micro-cones Cu fabricated by pulse electrodeposition for so..:

Zhang, Minghui ; Gao, Li-Yin ; Wang, Yu-Xi...
Applied Surface Science. 650 (2024) - p. 159184 , 2024

Link: https://doi.org/10.1016/..

6

Significant inhibition of interfacial Cu6Sn5 IMC and improv..:

Lu, Xiao ; Zhang, Liang ; Liu, Zhi-Quan...
Materials Characterization. 208 (2024) - p. 113668 , 2024

Link: https://doi.org/10.1016/..

7

The mechanical property and microstructural thermal stabili..:

Zhang, Yu-Bo ; Gao, Li-Yin ; Tao, Jun-Lei...
Materials Today Communications. 38 (2024) - p. 108182 , 2024

Link: https://doi.org/10.1016/..

8

Effect of impurities on anisotropic grain growth in (111)-o..:

Zhang, Minghui ; Gao, Li-Yin ; Zhang, Qi...
Materials Characterization. 214 (2024) - p. 114056 , 2024

Link: https://doi.org/10.1016/..

9

Mechanical behavior of high entropy ceramic (TiZrHfVNb)C₅ u..:

Wang, Zesong ; Liu, Guotan ; Gao, Weihong...
Ceramics International. 50 (2024) 6 - p. 9820-9831 , 2024

Link: https://doi.org/10.1016/..

10

Characterization of Cu-Cu direct bonding in ambient atmosph..:

Zhang, Minghui ; Gao, Li-Yin ; Li, Jun-Jie..
Materials Chemistry and Physics. 306 (2023) - p. 128089 , 2023

Link: https://doi.org/10.1016/..

11

Will Better Sintering Quality of Ag Nanoparticles Lead to M..:

Sun, Baorui ; Zhang, Minghui ; Li, Junjie...
Journal of Electronic Materials. 52 (2023) 11 - p. 7475-7483 , 2023

Link: https://doi.org/10.1007/..

12

A digital image correlation study on the microstructure and..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),

Zhang, Zhiqiang ; Li, Peifeng ; Sun, Rong. - p. 1-4 , 2023

Link: https://doi.org/10.1109/..

13

Effects of additive interactions on electroplating profile ..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),

Li, Xiao ; Li, Zhe ; Gao, Li-Yin.. - p. 1-6 , 2023

Link: https://doi.org/10.1109/..

14

Nanotwinned Microstructure Engineering of Electroplated Cop..:

Liu, Xing-Quan ; Li, Zhe ; Peng, Zhen-Jia..
Metals and Materials International. 30 (2023) 1 - p. 104-112 , 2023

Link: https://doi.org/10.1007/..

15

Orientation-related stress analysis of nanotwinned copper i..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),

Wang, Zesong ; Zhong, Cheng ; Li, Peifeng. - p. 1-5 , 2023

Link: https://doi.org/10.1109/..