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2024 International Conference on Electronics Packaging (ICEP) ,
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Stability Study of Quantum Dot Color Converted Mini/Micro-L..:
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2023 International Conference on Electronics Packaging (ICEP) ,
8
Quantum Dot Color Conversion Film with Enhanced Color Rende..:
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2023 IEEE CPMT Symposium Japan (ICSJ) ,
9
Pillar-Cavity Copper-Copper Bonding for Face-to-Face Carbon..:
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2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
10
Assembly of Printed Interconnects for Immobilized Protein M..:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
11
A UVC LED Disinfection Closet for Reuse of Protective Coats:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
12
Thermal-mechanical Reliability of Sintered Nano-Ag Bond Pad..:
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2022 International Conference on Electronics Packaging (ICEP) ,
13
Solderability Analysis of Inkjet-printed Silver Pads with S..:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
14
Inkjet Printing High Resolution Polydimethylsiloxane Dots A..:
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2022 International Conference on Electronics Packaging (ICEP) ,
15