Lo, A.C.
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2

Stability Study of Quantum Dot Color Converted Mini/Micro-L..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Cheng, Yuanjie ; Lo, Jeffery C.C. ; Qiu, Xing... - p. 1-2 , 2024
 
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5

A Flexible Thin-Film Inductor for High-Efficiency Wireless ..:

Yao, Yuan ; Qiu, Xing ; Cheng, Yuanjie...
IEEE Electron Device Letters.  44 (2023)  3 - p. 504-507 , 2023
 
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7

Interim Analysis of a Non-Randomized Prospective Trial Comp..:

Barcelona, M.V.N. ; Ngelangel, T.J.C.A. ; Uy, R.G....
International Journal of Radiation Oncology*Biology*Physics.  117 (2023)  2 - p. e163-e164 , 2023
 
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8

Quantum Dot Color Conversion Film with Enhanced Color Rende..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Cheng, Yuanjie ; Lo, Jeffery C. C. ; Qiu, Xing... - p. 135-136 , 2023
 
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9

Pillar-Cavity Copper-Copper Bonding for Face-to-Face Carbon..:

, In: 2023 IEEE CPMT Symposium Japan (ICSJ),
Xu, Hua ; Lo, Jeffery C.C. ; Qiu, Xing... - p. 21-24 , 2023
 
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10

Assembly of Printed Interconnects for Immobilized Protein M..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
 
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11

A UVC LED Disinfection Closet for Reuse of Protective Coats:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Qiu, Xing ; Lo, Jeffery C. C. ; Cheng, Yuanjie... - p. 1-5 , 2022
 
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12

Thermal-mechanical Reliability of Sintered Nano-Ag Bond Pad..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Lo, Jeffery C. C. ; Jiang, Qian ; Qiu, Xing.. - p. 1-4 , 2022
 
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13

Solderability Analysis of Inkjet-printed Silver Pads with S..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Jiang, Qian ; Tu, Ning ; Lo, Jeffery C. C.. - p. 65-66 , 2022
 
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14

Inkjet Printing High Resolution Polydimethylsiloxane Dots A..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
 
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15

Improved Inkjet Printing of Polydimethylsiloxane Droplets:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Tu, Ning ; Lo, Jeffery C.C. ; Lee, S.W. Ricky - p. 241-242 , 2022
 
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