E-LIB Suche - Ergebnisse für: Lo, Cheng-Yao

1

Integrated Automatic Optical Inspection and Image Processin..:

Qiu, Rong-Qing ; Tsai, Mu-Lin ; Chen, Yu-Wen..
Sensors. 24 (2024) 5 - p. 1619 , 2024

Link: https://doi.org/10.3390/..

2

Thermoresistive Profile Sensing Based on Isotropic Strain D..:

Yang, Yuan-Ren ; Liu, Teng-Chung ; Chen, Yu-Wen...
IEEE Sensors Journal. 24 (2024) 7 - p. 9506-9513 , 2024

Link: https://doi.org/10.1109/..

3

A 6-Gbps 16-nm FinFET CMOS I/O Buffer With Variation Insens..:

Wang, Chua-Chin ; Chodisetti, L S S Pavan Kumar ; Ke, Jhih-Ying...
IEEE Transactions on Circuits and Systems I: Regular Papers. , 2024

Link: https://doi.org/10.1109/..

4

Integrated Pressure and Proximity Sensors on Silicone and P..:

Pancham, Padmanabh Pundrikaksha ; Mukherjee, Anupam ; Yuan, Boong Lek...
IEEE Journal on Flexible Electronics. , 2024

Link: https://doi.org/10.1109/..

5

Multimode interference-based strain sensing using micro dry..:

Nakanishi, Takuto ; Kato, Akihito ; Wada, Yuji...
Japanese Journal of Applied Physics. , 2024

Link: https://doi.org/10.35848..

6

A 2.6-GHz I/O Buffer for DDR4 & DDR5 SDRAMs in 16-nm FinFET..:

, In: 2023 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS),

Ke, Jhih-Ying ; Santos Tolentino, Lean Karlo ; Lo, Cheng-Yao.. - p. 271-275 , 2023

Link: https://doi.org/10.1109/..

7

Functional Composite Silicone Made by Roll-to-Roll Manufact..:

, In: 2023 IEEE International Flexible Electronics Technology Conference (IFETC),

Pancham, Padmanabh Pundrikaksha ; Mukherjee, Anupam ; Yuan, Boong Lek... - p. 1-3 , 2023

Link: https://doi.org/10.1109/..

8

2-D Modelling of Fan-Out Panel Level Package and its Warpag..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),

Singh, Shivendra Pratap ; Pancham, Padmanabh Pundrikaksha ; Lo, Cheng-Yao - p. 53-56 , 2023

Link: https://doi.org/10.1109/..

9

Novel Graphene Transfer Method to Silicone and its Sensing ..:

Pancham, Padmanabh Pundrikaksha ; Mukherjee, Anupam ; Yuan, Boong Lek...
IEEE Sensors Letters. 7 (2023) 5 - p. 1-4 , 2023

Link: https://doi.org/10.1109/..

10

Novel Multiaxial Force Decoupling Strategy in Vertically St..:

Wu, Jie-Ying ; Hsu, Tzu-Yi ; Ahmad, Gufran..
IEEE Sensors Journal. 23 (2023) 24 - p. 30135-30142 , 2023

Link: https://doi.org/10.1109/..

11

Using Machine Learning Techniques to Determine DDR5 SDRAM I..:

, In: 2023 International Conference on Integrated Intelligence and Communication Systems (ICIICS),

Tolentino, Lean Karlo S. ; Ke, Jhih-Ying ; Lo, Cheng-Yao. - p. 1-6 , 2023

Link: https://doi.org/10.1109/..

12

Wearable and wireless performance evaluation system for spo..:

Zheng, Ye-Jin ; Wang, Wei-Cheng ; Chen, Yi-Yang...
Scientific Reports. 12 (2022) 1 - p. , 2022

Link: https://doi.org/10.1038/..

13

Capacitive Tactile Sensor with Stacked Structure and Hybrid..:

, In: 2022 IEEE Sensors,

Wu, Jie-Ying ; Pancham, Padmanabh P. ; Hsu, Tzu-Yi.. - p. 1-3 , 2022

Link: https://doi.org/10.1109/..

14

Smart manufacturing powered by recent technological advance..:

Sahoo, Snehasis ; Lo, Cheng-Yao
Journal of Manufacturing Systems. 64 (2022) - p. 236-250 , 2022

Link: https://doi.org/10.1016/..

15

Soft and flexible sensor array using carbon black pillars f..:

Yellapantula, Kartik ; Devaraj, Harish ; Assadian, Mahtab...
Measurement. 159 (2020) - p. 107781 , 2020

Link: https://doi.org/10.1016/..