E-LIB Suche - Ergebnisse für: Lo, Jeffery C. C

1

Stability Study of Quantum Dot Color Converted Mini/Micro-L..:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Cheng, Yuanjie ; Lo, Jeffery C.C. ; Qiu, Xing... - p. 1-2 , 2024

Link: https://doi.org/10.23919..

2

Development of Uniform Polydimethylsiloxane Arrays through ..:

Tu, Ning ; Lo, Jeffery C. C. ; Lee, S. W. Ricky
Polymers. 15 (2023) 2 - p. 462 , 2023

Link: https://doi.org/10.3390/..

3

Quantum Dot Color Conversion Film with Enhanced Color Rende..:

, In: 2023 International Conference on Electronics Packaging (ICEP),

Cheng, Yuanjie ; Lo, Jeffery C. C. ; Qiu, Xing... - p. 135-136 , 2023

Link: https://doi.org/10.23919..

4

Assembly of Printed Interconnects for Immobilized Protein M..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),

Xu, Qianwen ; Lee, S. W. Ricky ; Guo, Yusong. - p. 1-4 , 2023

Link: https://doi.org/10.23919..

5

A Flexible Thin-Film Inductor for High-Efficiency Wireless ..:

Yao, Yuan ; Qiu, Xing ; Cheng, Yuanjie...
IEEE Electron Device Letters. 44 (2023) 3 - p. 504-507 , 2023

Link: https://doi.org/10.1109/..

6

Pillar-Cavity Copper-Copper Bonding for Face-to-Face Carbon..:

, In: 2023 IEEE CPMT Symposium Japan (ICSJ),

Xu, Hua ; Lo, Jeffery C.C. ; Qiu, Xing... - p. 21-24 , 2023

Link: https://doi.org/10.1109/..

7

Solderability Analysis of Inkjet-printed Silver Pads with S..:

, In: 2022 International Conference on Electronics Packaging (ICEP),

Jiang, Qian ; Tu, Ning ; Lo, Jeffery C. C.. - p. 65-66 , 2022

Link: https://doi.org/10.23919..

8

A UVC LED Disinfection Closet for Reuse of Protective Coats:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),

Qiu, Xing ; Lo, Jeffery C. C. ; Cheng, Yuanjie... - p. 1-5 , 2022

Link: https://doi.org/10.1109/..

9

Improved Inkjet Printing of Polydimethylsiloxane Droplets:

, In: 2022 International Conference on Electronics Packaging (ICEP),

Tu, Ning ; Lo, Jeffery C.C. ; Lee, S.W. Ricky - p. 241-242 , 2022

Link: https://doi.org/10.23919..

10

Thermal-mechanical Reliability of Sintered Nano-Ag Bond Pad..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),

Lo, Jeffery C. C. ; Jiang, Qian ; Qiu, Xing.. - p. 1-4 , 2022

Link: https://doi.org/10.1109/..

11

Inkjet Printing High Resolution Polydimethylsiloxane Dots A..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),

Tu, Ning ; Lo, Jeffery C. C. ; Ricky Lee, S. W. - p. 1-4 , 2022

Link: https://doi.org/10.1109/..

12

Evaluation and Reduction of Optical Crosstalk in Quantum Do..:

, In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT),

Cheng, Yuanjie ; Lo, Jeffery C. C. ; Qiu, Xing. - p. 1-5 , 2021

Link: https://doi.org/10.1109/..

13

From LED to solid state lighting: principles, materials, pa..:

Lee, Shi-Wei Ricky ; Lo, Jeffery C. C ; Tao, Mian. , 2021

Link: https://onlinelibrary.wi..

14

Realizing Low Optical Crosstalk, Wide Color Gamut Mini-LED ..:

, In: 2021 International Conference on Electronics Packaging (ICEP),

Cheng, Yuanjie ; Lo, Jeffery C. C. ; Qiu, Xing. - p. 153-154 , 2021

Link: https://doi.org/10.23919..

15

Quantum Dot Film Patterning on a Trenched Glass Substrate f..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),

Cheng, Yuanjie ; Lo, Jeffery C. C. ; Qiu, Xing.. - p. 1-3 , 2020

Link: https://doi.org/10.1109/..