Lo, Penny
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1

Reliability of Fan-Out Wafer-Level Packaging with Large Chi..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Lau, John ; Kuah, Eric ; Li, Zhang... - p. 1574-1582 , 2018
 
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2

Fan-Out Wafer-Level Packaging for Heterogeneous Integration:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Lau, John ; Li, Zhang ; Tan, Kim Hwee... - p. 2360-2366 , 2018
 
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5

The assessment of criterion audit cycles by external peer r..:

Bowie, Paul ; Cooke, Sarah ; Lo, Penny..
Journal of Evaluation in Clinical Practice.  13 (2007)  3 - p. 352-357 , 2007
 
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10

Access to Adequate Healthcare for Hmong Women: A Patient Na..:

Penny Lo
https://www.hmongstudiesjournal.org/uploads/4/5/8/7/4587788/loetalhsj11.pdf.  , 2010
 
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12

Reward Versus Nonreward Sensitivity of the Medial Versus La..:

Xie, Chao ; Jia, Tianye ; Rolls, Edmund T....
Biological Psychiatry: Cognitive Neuroscience and Neuroimaging.  6 (2021)  3 - p. 259-269 , 2021
 
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