Lo, Yung-Hsiang
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2

Advanced Fan-Out Embedded Chip Process Integration for 3D A..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Hsiao, Chih-Cheng ; Hsu, Chao-Kai ; Li, Ching-Iang... - p. 181-182 , 2024
 
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4

Transcatheter Arterial Chemoembolization with Drug-Eluting ..:

Chang, Wei-Chou ; Hsu, Hsian-He ; Chiu, Sung-Hua...
Journal of Hepatocellular Carcinoma.  8 (2021)  - p. 937-949 , 2021
 
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5

Study of the Walk-Out Effect of Junction Breakdown Instabil..:

, In: 2020 IEEE International Reliability Physics Symposium (IRPS),
 
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13

Persistent sea surface temperature and declined sea surface..:

Lo, Li ; Lai, Yung-Hsiang ; Wei, Kuo-Yen...
Journal of Asian Earth Sciences.  66 (2013)  - p. 234-239 , 2013
 
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