E-LIB Suche - Ergebnisse für: Loh, Wei Keat

1

High Temperature Hygroscopic Swelling of Polymers in Electr..:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Chin, Ian ; Loh, Wei Keat ; Keel, Seow Chien... - p. 59-60 , 2024

2

A Novel Approach for Characterizing Epoxy Mold Compound Hig..:

Chin, Ian ; Loh, Wei Keat ; Bin Abdullah, Mohd Zulkifly
Journal of Microelectronics and Electronic Packaging. 20 (2023) 4 - p. , 2023

Link: https://doi.org/10.4071/..

3

Numerical investigation on rheology models during encapsula..:

Azmi, Muhammad Afiq ; Abdullah, Mohd Zulkifly ; Shuib, Raa Khimi...
Polymer Bulletin. 81 (2023) 3 - p. 2385-2406 , 2023

Link: https://doi.org/10.1007/..

4

Low temperature interconnects in 1st level packaging and it..:

, In: 2022 International Conference on Electronics Packaging (ICEP),

Arvin, Charles ; Lim, Sze Pei ; Locker, David... - p. 7-8 , 2022

Link: https://doi.org/10.23919..

5

Novel Method for Measuring High Temperature Hygroscopic Swe..:

, In: 2022 International Conference on Electronics Packaging (ICEP),

Chin, Ian ; Loh, Wei Keat ; Zulkifly Bin Abdullah, Mohd - p. 3-4 , 2022

Link: https://doi.org/10.23919..

6

Low temperature 1st level interconnect in Packaging and its..:

, In: 2021 International Conference on Electronics Packaging (ICEP),

Lim, Sze Pei ; Arvin, Charles ; Locker, David... - p. 49-50 , 2021

Link: https://doi.org/10.23919..

7

Predictive Modelling Methodologies for Bi-material Strip Wa..:

, In: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),

Wang, Jenn An ; Eu, Ong. Kang ; Weng, Wen Hsin... - p. 72-75 , 2020

Link: https://doi.org/10.1109/..

8

Industry Drop Tests in Solder Joint Reliability Study of Mo..:

, In: 2006 International Conference on Electronic Materials and Packaging,

Ong, Kang Eu ; Loh, Wei Keat ; Wong, Chee Wai... - p. None , 2006

Link: https://doi.org/10.1109/..

9

High Density Interconnect (HDI) Socket Flow & Waprage Predi..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),

Ooi, Renn Chan ; Costa, Franco ; Hsieh, Sam... - p. 632-638 , 2022

Link: https://doi.org/10.1109/..

10

Precision Medicine for Nasopharyngeal Cancer—A Review of Cu..:

Suryani, Luvita ; Lee, Hazel P. Y. ; Teo, Wei Keat...
Cancers. 16 (2024) 5 - p. 918 , 2024

Link: https://doi.org/10.3390/..

11

Clinical performance of a prefabricated immunofluorescence ..:

Chen, Vanessa Hui En ; Ong, Lizhen ; Teo, Wei Keat...
Head & Neck. , 2024

Link: https://doi.org/10.1002/..

12

Performance of a multigene genomic classifier and clinical ..:

Yang, Samantha Peiling ; Nga, Min En ; Bundele, Manish Mahadeorao...
Cancer Cytopathology. 132 (2024) 5 - p. 309-319 , 2024

Link: https://doi.org/10.1002/..

13

IFNγ−IL-17+ CD8 T cells contribute to immunosuppression and..:

Lee, Yun Hua ; Chuah, Samuel ; Nguyen, Phuong H.D....
Cancer Letters. 552 (2023) - p. 215977 , 2023

Link: https://doi.org/10.1016/..

14

A genomic enhancer signature associates with hepatocellular..:

Jeon, Ah-Jung ; Anene-Nzelu, Chukwuemeka George ; Teo, Yue-Yang...
JHEP Reports. 5 (2023) 6 - p. 100715 , 2023

Link: https://doi.org/10.1016/..

15

Multi-region sampling with paired sample sequencing analyse..:

Jeon, Ah-Jung ; Teo, Yue-Yang ; Sekar, Karthik...
BMC Cancer. 23 (2023) 1 - p. , 2023

Link: https://doi.org/10.1186/..