Lu, Quan-guo
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2

Research on Properties of Magnetic Machine Coupling for Mic..:

, In: 2010 2nd International Workshop on Intelligent Systems and Applications,
Yu, Zhen ; Zheng, Hui ; Chen, Ding-fang.. - p. 1-4 , 2010
 
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3

Fabrication of nano-crystalline W-Ni-Fe pre-alloyed powders..:

YAN, Jian-wu ; LIU, Ying ; PENG, A-fang.
Transactions of Nonferrous Metals Society of China.  19 (2009)  - p. s711-s717 , 2009
 
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4

Effective Field Grading at 200 °C of a Nonlinear Resistive ..:

Zhang, Zichen ; Yuchi, Qingrui ; Nicholas, Carl..
IEEE Transactions on Power Electronics.  39 (2024)  4 - p. 3974-3978 , 2024
 
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5

Package Design and Analysis of a 20-kV Double-Sided Silicon..:

Zhang, Zichen ; Arriola, Emmanuel ; Nicholas, Carl...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  5 - p. 776-783 , 2024
 
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6

Local Interconnection Degradation of a Double-Sided Cooling..:

Chen, Yue ; Mei, Yun-Hui ; Ning, Puqi.
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  5 - p. 832-840 , 2024
 
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7

Package Design of a Double-Side Cooled 20-kV Gallium Nitrid..:

, In: 2023 IEEE Applied Power Electronics Conference and Exposition (APEC),
Zhang, Zichen ; Nicholas, Carl ; Ngo, Khai D.T.. - p. 1622-1626 , 2023
 
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8

Chip Size Minimization for Wide and Ultrawide Bandgap Power..:

Wang, Boyan ; Xiao, Ming ; Zhang, Zichen...
IEEE Transactions on Electron Devices.  70 (2023)  2 - p. 633-639 , 2023
 
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9

Copper-Wire Stress Buffers for Extending Lifetime of Double..:

Liu, Siqi ; Mei, Yun-Hui ; Li, Jing..
IEEE Transactions on Power Electronics.  38 (2023)  6 - p. 7118-7127 , 2023
 
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10

Double-Side Cooled SiC MOSFET Power Modules With Sintered-S..:

Ding, Chao ; Lu, Shengchang ; Zhang, Zichen...
IEEE Transactions on Power Electronics.  38 (2023)  8 - p. 9685-9694 , 2023
 
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11

Packaging of 20 kV Double-Side Cooled Silicon Carbide Diode..:

, In: 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe),
Zhang, Zichen ; Nicholas, Carl ; Emmanuel, Arriola... - p. P.1-P.6 , 2023
 
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12

Genome-Wide Identification and Expression Analysis of the X..:

Zhang, Jing-Zhen ; He, Pei-Wen ; Xu, Xi-Ming...
International Journal of Molecular Sciences.  24 (2023)  1 - p. 775 , 2023
 
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13

Thermo-Mechanical Analysis of a 650 V/150 A e-GaN HEMT Sand..:

, In: 2023 IEEE 10th Workshop on Wide Bandgap Power Devices & Applications (WiPDA),
 
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14

Effects of Encapsulant Properties on the Thermo-Mechanical ..:

, In: 2023 IEEE Energy Conversion Congress and Exposition (ECCE),
Boshkovski, Filip ; Nicholas, Carl ; Zhang, Zichen... - p. 5934-5938 , 2023
 
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15

Review of Double-Sided Cooling Power Modules for Driving El..:

Lu, Panpan ; Li, Longnv ; Lu, Guo-Quan...
IEEE Transactions on Device and Materials Reliability.  23 (2023)  2 - p. 287-296 , 2023
 
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