Luo, Qiufa
20  results:
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2

Effects of processing parameters and grinding direction on ..:

Xin, Yongkang ; Lu, Jing ; Li, Chen...
Diamond and Related Materials.  141 (2024)  - p. 110685 , 2024
 
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Study on removal mechanism of polycrystalline diamond wafer..:

Li, Zesen ; Lu, Jing ; Xin, Yongkang...
Diamond and Related Materials.  148 (2024)  - p. 111366 , 2024
 
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Synergistic effect of abrasive friction and glycine on impr..:

Ke, Congming ; Liu, Shoulin ; Pang, Yiao...
Ceramics International.  50 (2024)  12 - p. 21357-21366 , 2024
 
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Sol–gel polishing technology for extremely hard semiconduct..:

Luo, Qiufa ; Wen, Hailang ; Lu, Jing
The International Journal of Advanced Manufacturing Technology.  120 (2022)  3-4 - p. 1415-1432 , 2022
 
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12

Fabrication of a sol–gel polishing tool for green manufactu..:

Luo, Qiufa ; Lu, Jing ; Li, Zhen.
Journal of Sol-Gel Science and Technology.  96 (2020)  3 - p. 576-588 , 2020
 
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14

Study on nanomechanical properties of 4H-SiC and 6H-SiC by ..:

Tian, Zige ; Xu, Xipeng ; Jiang, Feng...
Ceramics International.  45 (2019)  17 - p. 21998-22006 , 2019
 
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Surface damage of single-crystal diamond (100) processed ba..:

Lin, Yingchao ; Lu, Jing ; Tong, Ruilong..
Diamond and Related Materials.  83 (2018)  - p. 46-53 , 2018
 
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