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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
12
Sintered Micro-Silver Paste Doped with Indium for Die Attac..:
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2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
13
Characterization of Alternative Sinter Materials for Power ..:
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2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ,
14
Die Attachment on Bare Copper Surface by Non-Pressure Silve..:
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2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ,
15