Lyu, Shuhang
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1

Thermo-Mechanical Reliability Analysis and Raman Spectrosco..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lyu, Shuhang ; Beechem, Thomas E. ; Wei, Tiwei - p. 834-841 , 2024
 
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2

Thermomechanical Modeling and Stress Analysis of Copper Inv..:

Lyu, Shuhang ; Wu, Qianying ; Gong, Zheng...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  6 - p. 1025-1035 , 2024
 
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3

A Novel Copper Microporous-Assisted Bonding Method for Fine..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Wang, Keyu ; Lyu, Shuhang ; Wei, Tiwei - p. 563-570 , 2024
 
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5

Hotspot-targeted Cooling Scheme with Hybrid Jet Impingement..:

, In: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Lyu, Shuhang ; Wu, Qianying ; Wei, Tiwei - p. 1-9 , 2023
 
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13

Kinetics of thermal degradation of raw lacquer enhanced by ..:

Xiao, Qiang ; Cao, Yanjun ; Zheng, Wenyu...
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC9886932/.  , 2023
 
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14

Digital twin: meeting the technical challenges of intellige..:

GE Shirong ; WANG Shibo ; GUAN Zenglun...
http://www.gkzdh.cn/article/doi/10.13272/j.issn.1671-251x.17959.  , 2022
 
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