Search for persons
X
?
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
Thermo-Mechanical Reliability Analysis and Raman Spectrosco..:
, In:
?
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
3
A Novel Copper Microporous-Assisted Bonding Method for Fine..:
, In:
?
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
5