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2024 International Conference on Electronics Packaging (ICEP) ,
1
Design of Panel Level Package and Power and Signal Integrit..:
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2020 IEEE/SICE International Symposium on System Integration (SII) ,
2
Time Capsule Gift with Affective Awareness of Event Memorie..:
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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2019 ,
3