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Mai, Y. W
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1

Prediction of Crack Initiation at Die Corner of Molded Unde..:

Lyu, G.C. ; Zhang, X.P. ; Zhou, M.B...
IEEE Transactions on Device and Materials Reliability.  , 2024
Link: https://doi.org/10.1109/..
 
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2

Zeitschrift für Angewandte Mathematik und Mechanik 

Zeitschrift für Angewandte Mathematik und Mechanik ; Volume 69, Number 3
Bosznay, Á. ; Chakrabarti, A. ; Dierscii, H.-J.... - Reprint 2021 . , [2022]
Link: https://doi.org/10.1515/..
 
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3

Science and engineering of short fibre-reinforced polymer c.. 

Woodhead Publishing series in composites science and engineering
Fu, Shao-Yun ; Lauke, Bernd ; Mai, Y. W - Second edition. . , 2019
Link: https://www.sciencedirec..
 
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4

Joule heating dominated fracture behavior change in micro-s..:

Li, W.Y. ; Zhang, X.P. ; Qin, H.B..
Microelectronics Reliability.  82 (2018)  - p. 224-227 , 2018
Link: https://doi.org/10.1016/..
 
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5

An experimental study of orthogonal cutting mechanisms for ..:

Wang, H. ; Chang, L. ; Mai, Y.-W...
International Journal of Machine Tools and Manufacture.  124 (2018)  - p. 117-125 , 2018
Link: https://doi.org/10.1016/..
 
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6

Polymer nanofiber composites:

, In: Nanofiber Composites for Biomedical Applications,
Baji, A. ; Mai, Y.-W. - p. 55-78 , 2017
Link: https://doi.org/10.1016/..
 
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7

Microwave absorbing properties of composites containing ult..:

Zheng, X.F. ; Qin, F.X. ; Wang, H...
Composites Science and Technology.  151 (2017)  - p. 62-70 , 2017
Link: https://doi.org/10.1016/..
 
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8

List of contributors:

, In: Nanofiber Composites for Biomedical Applications,
Ahadian, S. ; Almeida, L. ; Amit Kumar, J.... - p. xi-xiii , 2017
Link: https://doi.org/10.1016/..
 
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9

Polymer nanocomposites: towards multi-functionality 

Engineering materials and processes
Dasari, Aravind ; Yu, Zhong-Zhen ; Mai, Y. W , 2016
Link: https://search.ebscohost..
 
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10

Advances in diffusion and vapour pressure modelling:

, In: Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture,
Wong, E.-H. ; Mai, Y.-W. - p. 167-198 , 2015
Link: https://doi.org/10.1016/..
 
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11

Moisture properties and their characterisations:

, In: Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture,
Wong, E.-H. ; Mai, Y.-W. - p. 125-165 , 2015
Link: https://doi.org/10.1016/..
 
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12

Subsystem testing of solder joints against drop impact:

, In: Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture,
Wong, E.-H. ; Mai, Y.-W. - p. 221-260 , 2015
Link: https://doi.org/10.1016/..
 
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13

Rate-dependent stress–strain properties of solders:

, In: Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture,
Wong, E.-H. ; Mai, Y.-W. - p. 411-446 , 2015
Link: https://doi.org/10.1016/..
 
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14

Fatigue resistance of solder joints:

, In: Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture,
Wong, E.-H. ; Mai, Y.-W. - p. 261-300 , 2015
Link: https://doi.org/10.1016/..
 
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15

Robust design of microelectronics assemblies against mechan.. 

Woodhead Publishing series in electronic and optical materials, number 81
Wong, E. -H ; Mai, Y. W , 2015
Link: https://www.sciencedirec..
 
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