E-LIB Suche - Ergebnisse für: Mallik, Sabuj

1

Determination of Natural Logarithm of Diffusion Coefficient..:

Gbasouzor, Austin Ikechukwu ; Omenyi, Sam Nna ; Mallik, Sabuj.
World Journal of Engineering and Technology. 12 (2024) 1 - p. 213-228 , 2024

Link: https://doi.org/10.4236/..

2

Effect of Creep, Fatigue and Random Vibration on the Integr..:

Depiver, Joshua A. ; Mallik, Sabuj ; Amalu, Emeka H.
Microelectronics Reliability. 157 (2024) - p. 115415 , 2024

Link: https://doi.org/10.1016/..

3

Characterising Solder Materials from Random Vibration Respo..:

Depiver, Joshua A. ; Mallik, Sabuj ; Amalu, Emeka H.
Journal of Electronic Materials. , 2023

Link: https://doi.org/10.1007/..

4

An Empirical Study on Convective Drying of Ginger Rhizomes ..:

Depiver, Joshua Adeniyi ; Mallik, Sabuj
Agriculture. 13 (2023) 7 - p. 1322 , 2023

Link: https://doi.org/10.3390/..

5

Effects of Reflow Profile and Miniaturisation on the Integr..:

Njoku, Jude E. ; Amalu, Emeka H. ; Ekere, Ndy...
Journal of Electronic Materials. 52 (2023) 6 - p. 3786-3796 , 2023

Link: https://doi.org/10.1007/..

6

Thermal fatigue life of ball grid array (BGA) solder joints..:

Depiver, Joshua A. ; Mallik, Sabuj ; Amalu, Emeka H.
Engineering Failure Analysis. 125 (2021) - p. 105447 , 2021

Link: https://doi.org/10.1016/..

7

Effective Solder for Improved Thermo-Mechanical Reliability..:

Depiver, Joshua A. ; Mallik, Sabuj ; Amalu, Emeka H.
Journal of Electronic Materials. 50 (2020) 1 - p. 263-282 , 2020

Link: https://doi.org/10.1007/..

8

Comparing and Benchmarking Fatigue Behaviours of Various SA..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),

Adeniyi Depiver, Joshua ; Mallik, Sabuj ; Amalu, Emeka H. - p. 1-11 , 2020

Link: https://doi.org/10.1109/..

9

Creep Damage of BGA Solder Interconnects Subjected to Therm..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),

Depiver, Joshua A. ; Mallik, Sabuj ; Harmanto, Dani. - p. 143-153 , 2019

Link: https://doi.org/10.1109/..

10

A Study on the Effect of Ageing and Intermetallic Compound ..:

Nath, Jyotishman ; Mallik, Sabuj ; Borah, Anil
Journal of The Institution of Engineers (India): Series D. 96 (2015) 1 - p. 1-6 , 2015

Link: https://doi.org/10.1007/..

11

Effect of intermetallic compound layer thickness on the she..:

Bernasko, Peter K. ; Mallik, Sabuj ; Takyi, G.
Soldering & Surface Mount Technology. 27 (2015) 1 - p. 52-58 , 2015

Link: https://doi.org/10.1108/..

12

Fatigue life of lead-free solder thermal interface material..:

Ekpu, Mathias ; Bhatti, Raj ; Okereke, Michael I...
Microelectronics Reliability. 54 (2014) 1 - p. 239-244 , 2014

Link: https://doi.org/10.1016/..

13

The effect of thermal constriction on heat management in a ..:

Ekpu, Mathias ; Bhatti, Raj ; Okereke, M.I...
Microelectronics Journal. 45 (2014) 2 - p. 159-166 , 2014

Link: https://doi.org/10.1016/..

14

Stencil printing behavior of lead-free Sn-3Ag-0.5Cu solder ..:

Kumar, Santosh ; Mallik, Sabuj ; Ekere, Ndy.
Metals and Materials International. 19 (2013) 5 - p. 1083-1090 , 2013

Link: https://doi.org/10.1007/..

15

Nonlinear Viscoelastic Characteristics of Sn-Ag-Cu Solder P..:

Mallik, Sabuj ; Chan, Erica Hiu Laam ; Ekere, Ndy
Journal of Materials Engineering and Performance. 22 (2012) 4 - p. 1186-1193 , 2012

Link: https://doi.org/10.1007/..