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Marinissen, Erik Jan
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1

Design-for-Test for Intermittent Faults in STT-MRAMs:

, In: 2024 IEEE European Test Symposium (ETS),
Yuan, Sicong ; Yaldagard, Mohammad Amin ; Xun, Hanzhi... - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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2

IEEE Std P3405: New Standard-under-Development for Chiplet ..:

, In: 2024 IEEE 42nd VLSI Test Symposium (VTS),
Marinissen, Erik Jan ; Pancholi, Vineet ; Chuang, Po-Yao. - p. 1-11 , 2024
Link: https://doi.org/10.1109/..
 
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3

Test and Repair Improvements for UCIe:

, In: 2024 IEEE European Test Symposium (ETS),
Wang, Tsung-Hsuan ; Chuang, Po-Yao ; Lorenzelli, Francesco. - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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4

Silent Data Corruption: Test or Reliability Problem?:

, In: 2024 IEEE European Test Symposium (ETS),
Marinissen, Erik Jan ; Dattatraya Dixit, Harish ; Blanton, Shawn... - p. 1-7 , 2024
Link: https://doi.org/10.1109/..
 
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5

New Standard-under-Development for Chiplet Interconnect Tes..:

, In: 2024 IEEE European Test Symposium (ETS),
Marinissen, Erik Jan ; Evans, Adrian ; Chuang, Po-Yao.. - p. 1-10 , 2024
Link: https://doi.org/10.1109/..
 
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6

Effective and Efficient Testing of Large Numbers of Inter-D..:

, In: 2023 IEEE 41st VLSI Test Symposium (VTS),
Chuang, Po-Yao ; Lorenzelli, Francesco ; Chakravarty, Sreejit... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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7

Generating Test Patterns for Chiplet Interconnects: Achievi..:

, In: 2023 IEEE International Test Conference in Asia (ITC-Asia),
Chuang, Po-Yao ; Lorenzelli, Francesco ; Marinissen, Erik Jan - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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8

IP Session on Chiplet: Design, Assembly, and Test:

, In: 2023 IEEE 41st VLSI Test Symposium (VTS),
Vinnakota, Bapi ; Derakhshandeh, Jaber ; Beyne, Eric.. - p. 1-1 , 2023
Link: https://doi.org/10.1109/..
 
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9

Wafer-Scale Electrical Characterization of Silicon Quantum ..:

, In: 2023 IEEE International Test Conference (ITC),
Lorenzelli, Francesco ; Elsayed, Asser ; Godfrin, Clement... - p. 151-158 , 2023
Link: https://doi.org/10.1109/..
 
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10

Device Aware Diagnosis for Unique Defects in STT-MRAMs:

, In: 2023 IEEE 32nd Asian Test Symposium (ATS),
Aouichi, Ahmed ; Yuan, Sicong ; Fieback, Moritz... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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11

Effective and Efficient Test and Diagnosis Pattern Generati..:

, In: 2023 IEEE International 3D Systems Integration Conference (3DIC),
Chuang, Po-Yao ; Lorenzelli, Francesco ; Chakravarty, Sreejit... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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12

Device-Aware Test for Back-Hopping Defects in STT-MRAMs:

, In: 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE),
Yuan, Sicong ; Taouil, Mottaqiallah ; Fieback, Moritz... - p. 1-6 , 2023
Link: https://doi.org/10.23919..
 
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13

Moore Meets Murphy : Invited Talk 1:

, In: 2023 IEEE International Test Conference in Asia (ITC-Asia),
Marinissen, Erik Jan - p. 1-1 , 2023
Link: https://doi.org/10.1109/..
 
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14

A Bypassable Scan Flip-Flop for Low Power Testing With Data..:

Cao, Xugang ; Jiao, Hailong ; Marinissen, Erik Jan
IEEE Transactions on Circuits and Systems II: Express Briefs.  69 (2022)  2 - p. 554-558 , 2022
Link: https://doi.org/10.1109/..
 
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15

MFA-MTJ Model: Magnetic-Field-Aware Compact Model of pMTJ f..:

Wu, Lizhou ; Rao, Siddharth ; Taouil, Mottaqiallah...
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.  41 (2022)  11 - p. 4991-5004 , 2022
Link: https://doi.org/10.1109/..
 
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