E-LIB Suche - Ergebnisse für: Matsumae, Takashi

1

Direct bonding of Germanium and Diamond substrates by reduc..:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Minowa, Yuki ; Matsumae, Takashi ; Hayase, Masanori.. - p. 119-120 , 2024

Link: https://doi.org/10.23919..

2

Template Stripping Process Combined With Polyimide and SiO2..:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Koseki, Shogo ; Ogino, Mika ; Takeuchi, Kai... - p. 129-130 , 2024

Link: https://doi.org/10.23919..

3

Ultra-High Vacuum Cells Realized by Miniature Ion Pump Usin..:

Kurashima, Yuichi ; Maeda, Atsuhiko ; Oshima, Naoto...
Sensors. 24 (2024) 12 - p. 4000 , 2024

Link: https://doi.org/10.3390/..

4

Simple Low-Temperature GaN/Diamond Bonding Process with an ..:

Matsumae, Takashi ; Okita, Sho ; Fukumoto, Shoya...
ACS Applied Nano Materials. 6 (2023) 15 - p. 14076-14082 , 2023

Link: https://doi.org/10.1021/..

5

Direct bonding of germanium and diamond substrates by hydro..:

, In: 2023 International Conference on Electronics Packaging (ICEP),

Minowa, Yuki ; Matsumae, Takashi ; Hayase, Masanori.. - p. 171-172 , 2023

Link: https://doi.org/10.23919..

6

Hydrophilic Bonding of GaN and Diamond Substrates:

Matsumae, Takashi ; Okita, Sho ; Fukumoto, Shoya...
ECS Transactions. 112 (2023) 3 - p. 265-268 , 2023

Link: https://doi.org/10.1149/..

7

(Invited, Digital Presentation) Low-Temperature Direct Bond..:

Matsumae, Takashi ; Umezawa, Hitoshi ; Kurashima, Yuichi.
ECS Transactions. 111 (2023) 2 - p. 53-60 , 2023

Link: https://doi.org/10.1149/..

8

Template Stripping of Au from Polyimide Film for Smoothing ..:

, In: 2023 IEEE CPMT Symposium Japan (ICSJ),

Koseki, Shogo ; Ogino, Mika ; Takeuchi, Kai... - p. 133-134 , 2023

Link: https://doi.org/10.1109/..

9

High-Efficiency Plasma Source Using a Magnetic Mirror Trap ..:

Kurashima, Yuichi ; Motomura, Taisei ; Yanagimachi, Shinya...
Sensors. 23 (2023) 2 - p. 1040 , 2023

Link: https://doi.org/10.3390/..

10

Room temperature bonding of GaN and diamond substrates via ..:

Matsumae, Takashi ; Kurashima, Yuichi ; Takagi, Hideki...
Scripta Materialia. 215 (2022) - p. 114725 , 2022

Link: https://doi.org/10.1016/..

11

Hydrophilic direct bonding of GaN and Si substrates by wet ..:

Fukumoto, Shoya ; Matsumae, Takashi ; Kurashima, Yuichi...
Japanese Journal of Applied Physics. 61 (2022) SF - p. SF1005 , 2022

Link: https://doi.org/10.35848..

12

Simple and low-temperature vacuum packaging process by usin..:

Kariya, Shingo ; Matsumae, Takashi ; Kurashima, Yuichi...
Japanese Journal of Applied Physics. 61 (2022) 5 - p. 051004 , 2022

Link: https://doi.org/10.35848..

13

Hydrophilic direct bonding of GaN and Si substrates by wet ..:

Fukumoto, Shoya ; Matsumae, Takashi ; KURASHIMA, Yuichi...
Japanese Journal of Applied Physics. , 2022

Link: https://doi.org/10.35848..

14

Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based ..:

Matsumae, Takashi ; Kariya, Shingo ; Kurashima, Yuichi...
Sensors. 22 (2022) 21 - p. 8144 , 2022

Link: https://doi.org/10.3390/..

15

Bonding formation and gas absorption using Au/Pt/Ti layers ..:

Kariya, Shingo ; Matsumae, Takashi ; Kurashima, Yuichi...
Microsystems & Nanoengineering. 8 (2022) 1 - p. , 2022

Link: https://doi.org/10.1038/..