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2024 International Conference on Electronics Packaging (ICEP) ,
1
Direct bonding of Germanium and Diamond substrates by reduc..:
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2024 International Conference on Electronics Packaging (ICEP) ,
2
Template Stripping Process Combined With Polyimide and SiO2..:
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2023 International Conference on Electronics Packaging (ICEP) ,
5
Direct bonding of germanium and diamond substrates by hydro..:
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2023 IEEE CPMT Symposium Japan (ICSJ) ,
8