Search for persons
X
?
2023 International Electron Devices Meeting (IEDM) ,
6
3D sequential integration with Si CMOS stacked on 28nm indu..:
, In:
?
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
14
A reliable copper-free wafer level hybrid bonding technolog..:
, In:
?
2019 International 3D Systems Integration Conference (3DIC) ,
15