McDonald, Stuart
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1

Temperature-Dependent Electrical Resistivity in Sn-Bi Alloy:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Tan, Xin F. ; Hao, Qichao ; Zhou, Jiye... - p. 207-208 , 2024
 
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3

Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Fre..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Zhou, Jiye ; Tan, Xin F. ; McDonald, Stuart D.... - p. 81-82 , 2024
 
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4

In-situ observations of CU6Sn5 mophological changes at the ..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Nogita, Kazuhiro ; Tan, Xin F. ; Somidin, Flora... - p. 215-216 , 2024
 
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5

Community Healthcare: Safety, Privacy, and Usability of Sma..:

, In: 2024 Second International Conference on Emerging Trends in Information Technology and Engineering (ICETITE),
Cai, Tianhong ; Zhang, Xiang ; Li, Yinglun.. - p. 1-7 , 2024
 
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11

Associations of inflammatory cytokines and cortisol with no..:

Bilal, Hiba ; McDonald, Stuart J. ; Stout, Julie C..
Annals of Clinical and Translational Neurology.  11 (2024)  4 - p. 989-999 , 2024
 
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12

Controlling Pore Position during Transient Liquid Phase Bon..:

Razak, N. R. Abdul ; Tan, Xin F. ; McDonald, Stuart D....
Transactions of The Japan Institute of Electronics Packaging.  17 (2024)  0 - p. E23-009-1-E23-009-9 , 2024
 
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