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2024 International Conference on Electronics Packaging (ICEP) ,
1
Temperature-Dependent Electrical Resistivity in Sn-Bi Alloy:
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2024 International Conference on Electronics Packaging (ICEP) ,
10
Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Fre..:
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2024 Second International Conference on Emerging Trends in Information Technology and Engineering (ICETITE) ,
12
Community Healthcare: Safety, Privacy, and Usability of Sma..:
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2024 International Conference on Electronics Packaging (ICEP) ,
15