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Mei, Yunhui
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1

Low-temperature curable permalloy-based soft magnetic compo..:

Lu, Panpan ; Mei, Yunhui
Materials Science and Engineering: B.  307 (2024)  - p. 117481 , 2024
Link: https://doi.org/10.1016/..
 
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2

Development of Silver Paste With High Sintering Driving For..:

Zhang, Bowen ; Lu, Xinyan ; Ma, Haoxiang..
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  1 - p. 10-17 , 2024
Link: https://doi.org/10.1109/..
 
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3

Reliable WBG Devices Packaging by Forming Nano-gradient Str..:

Zhang, Bowen ; Zhao, Zhiyuan ; Liu, Yi...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  , 2024
Link: https://doi.org/10.1109/..
 
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4

Local Interconnection Degradation of a Double-Sided Cooling..:

Chen, Yue ; Mei, Yun-Hui ; Ning, Puqi.
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  5 - p. 832-840 , 2024
Link: https://doi.org/10.1109/..
 
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5

A Gate Driver Circuit for Crosstalk Suppression of SiC MOSF..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Li, Longnv ; Xiao, Man ; Wang, Lu.. - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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6

Feasibility Investigation and Characterization of Liquid Di..:

Wei, Wenyuan ; Gao, Lilan ; Tan, Yansong...
Advanced Engineering Materials.  25 (2023)  10 - p. , 2023
Link: https://doi.org/10.1002/..
 
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7

Optoelectronic Materials, Devices, and Applications:

Niu, Pingjuan ; Pei, Li ; Mei, Yunhui..
Applied Sciences.  13 (2023)  13 - p. 7514 , 2023
Link: https://doi.org/10.3390/..
 
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8

Simulation of Thermal Distribution in SiC Power Modules wit..:

, In: 2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS),
Hui, Xiaoshuang ; Ning, Puqi ; Fan, Tao... - p. 1659-1664 , 2023
Link: https://doi.org/10.1109/..
 
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9

Review of Hybrid Packaging Methods for Power Modules:

Ning, Puqi ; Hui, Xiaoshuang ; Kang, Yuhui...
Chinese Journal of Electrical Engineering.  9 (2023)  4 - p. 23-40 , 2023
Link: https://doi.org/10.23919..
 
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10

Design of a Novel Double Sided Cooling SiC Power Module Bas..:

, In: 2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS),
Kang, Yuhui ; Ning, Puqi ; Hui, Xiaoshuang... - p. 418-422 , 2023
Link: https://doi.org/10.1109/..
 
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11

A Double-Sided 650 V GaN Power Device Using Flexible Buffer..:

, In: 2023 IEEE 14th International Symposium on Power Electronics for Distributed Generation Systems (PEDG),
Liu, Siqi ; Li, Longnv ; Mei, Yun-Hui - p. 169-173 , 2023
Link: https://doi.org/10.1109/..
 
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12

Copper-Wire Stress Buffers for Extending Lifetime of Double..:

Liu, Siqi ; Mei, Yun-Hui ; Li, Jing..
IEEE Transactions on Power Electronics.  38 (2023)  6 - p. 7118-7127 , 2023
Link: https://doi.org/10.1109/..
 
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13

Insulation and Reliability Enhancement by a Nonlinear Condu..:

Sun, Kai-Bing ; Mei, Yun-Hui ; Shuai, Zhi-Bin.
IEEE Transactions on Dielectrics and Electrical Insulation.  30 (2023)  6 - p. 2514-2521 , 2023
Link: https://doi.org/10.1109/..
 
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14

Review of Double-Sided Cooling Power Modules for Driving El..:

Lu, Panpan ; Li, Longnv ; Lu, Guo-Quan...
IEEE Transactions on Device and Materials Reliability.  23 (2023)  2 - p. 287-296 , 2023
Link: https://doi.org/10.1109/..
 
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15

Reliability Improvement of Low-Temperature Sintered Nano-Si..:

Zhang, Bowen ; Zhang, Shaoqiong ; Lu, Xinyan..
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  8 - p. 1209-1217 , 2023
Link: https://doi.org/10.1109/..
 
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