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2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) ,
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Su-Schrieffer-Heeger Topological Electrical Circuit Using I..:
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2024 IEEE 36th International Conference on Microelectronic Test Structures (ICMTS) ,
2
Test Structure to Assess Bump Shape Influence on Hybrid Bon..:
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2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) ,
3
Constructing Temperature Constant Controlled Silicon-on-Ins..:
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2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS) ,
4
Nanospires Insulation Penetrator for Reliable on-Touch Elec..:
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2024 IEEE 36th International Conference on Microelectronic Test Structures (ICMTS) ,
5
An Add-in Test Structure Chip to Unitedly Assess PVD Materi..:
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2023 35th International Conference on Microelectronic Test Structure (ICMTS) ,
6
Damage Assessment Structure of Thermal-Annealing Post-Proce..:
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2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) ,
7
Integration of a CMOS LSI Chiplet into Micro Flexible Devic..:
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2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) ,
11
Self-Deformable Flexible Mems Tweezer Made of Poly (Vinylid..:
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2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) ,
12