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2024 International Conference on Electronics Packaging (ICEP) ,
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Delamination of Metallized AlN Substrate under Thermal Cycl..:
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2023 International Conference on Electronics Packaging (ICEP) ,
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Measurement of Thermal Strain of Metallized Silicon Nitride..:
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2023 International Conference on Electronics Packaging (ICEP) ,
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Effect of Thermal Cycle Temperature Gap on Thermal Fatigue ..:
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IGARSS 2023 - 2023 IEEE International Geoscience and Remote Sensing Symposium ,
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Examining Model Generality of Instance Segmentation for Bui..:
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Disaster Risk Reduction; Society 5.0, Digital Transformation and Disasters ,
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Digital Transformation and Disaster Risk Reduction:
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Society 5.0, Digital Transformation and Disasters: Past, Pr..
Disaster Risk Reduction, Methods, Approaches and Practices
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2022 IEEE International Solid- State Circuits Conference (ISSCC) ,
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A64FX: 52-Core Processor Designed for the 442PetaFLOPS Supe..:
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Sustainable Development Goals Series; Disaster Nursing, Primary Health Care and Communication in Uncertainty ,
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Correction to: Geographic Information System(GIS) and Data ..:
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Sustainable Development Goals Series; Disaster Nursing, Primary Health Care and Communication in Uncertainty ,
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Geographic Information System (GIS) and Data Visualization:
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Sustainable Development Goals Series; Disaster Nursing, Primary Health Care and Communication in Uncertainty ,
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