Moon, Chanmi
32  results:
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1

Forming Limit Prediction of Multi-layered Metal-Polymer She..:

, In: Lecture Notes in Mechanical Engineering; Proceedings of the 14th International Conference on the Technology of Plasticity - Current Trends in the Technology of Plasticity,
Hou, Yong ; Moon, Chanmi ; Hu, Qi... - p. 455-462 , 2023
 
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3

Anxiety in hospitalized patients with infectious diseases p..:

Moon, Chan-Mi ; Im, Ye-seul
Journal of Korean Biological Nursing Science.  25 (2023)  4 - p. 243-253 , 2023
 
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4

Mechanical behavior and interfacial damage of carbon steel-..:

Moon, Chanmi ; Won, Jung Yun ; Lee, Kijung...
Materials Science and Engineering: A.  852 (2022)  - p. 143697 , 2022
 
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6

A Review on Friction and Lubrication in Automotive Metal Fo..:

Lee, Kijung ; Moon, Chanmi ; Lee, Myoung-Gyu
International Journal of Automotive Technology.  22 (2021)  6 - p. 1743-1761 , 2021
 
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7

Experimental study on the mechanical properties of 7xxx alu..:

Choi, Yumi ; Moon, Chanmi ; Lee, Myoug-Gyu
IOP Conference Series: Materials Science and Engineering.  651 (2019)  1 - p. 012080 , 2019
 
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8

Mechanical behavior and interfacial damage of carbon steel-..:

Moon, Chanmi ; Won, Jung Yun ; Lee, Kijung...
Materials Science and Engineering: A, Vol.852, p. 143697.  , 2022
 
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9

Experimental study on the mechanical properties of 7xxx alu..:

Choi, Yumi ; Moon, Chanmi ; Lee, Myoug-Gyu
IOP Conference Series : Materials Science and Engineering, Vol.651, p. 012080.  , 2022
 
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10

Chip-on-Wafer (CoW) Technology Utilizing Laser-Assisted Bon..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Choi, Kwang-Seong ; Joo, Jiho ; Choi, Gwang-Mun... - p. 943-948 , 2024
 
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11

91‐2: Transfer, Bonding, and Repair of LEDs for µLED Displa..:

Shin, Jungho ; Joo, Jiho ; Choi, Gwang-Mun...
SID Symposium Digest of Technical Papers.  55 (2024)  1 - p. 1278-1281 , 2024
 
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13

30‐5: Late‐News Paper: Development of a highly reliable Min..:

Joo, Jiho ; Choi, Gwang-Mun ; Lee, Chanmi...
SID Symposium Digest of Technical Papers.  54 (2023)  1 - p. 433-436 , 2023
 
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14

Micro-structure analysis of solder joint using room tempera..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Moon, Yoon Hwan ; Joo, Jiho ; Choi, Gwang-Mun... - p. 01-06 , 2023
 
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15

Process Window of Mini-LED Display Panel Packaging using La..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
 
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