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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Chip-on-Wafer (CoW) Technology Utilizing Laser-Assisted Bon..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Laser-Assisted Bonding with Compression (LABC) based Tiling..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Laser-Assisted Bonding (LAB) Process and its Bonding Materi..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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