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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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System Level Analysis and Design Optimization of Back-side ..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
2
Effective Interface Simulation Approach Based on Peak Disto..:
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2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ,
3
Power Integrity Design of Mobile 3D-IC Based on the Allocat..:
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2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) ,
5
Design and Analysis of Double-side Characteristic Impedance..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
6
Statistical Analysis of Off-chip Power-Integrity for Multic..:
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2023 IEEE 27th Workshop on Signal and Power Integrity (SPI) ,
7
Advanced Phase Jitter Analysis with Power Noise Induced Jit..:
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2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) ,
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Experimental Method for Measuring the Jitter Sensitivity Fu..:
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2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) ,
9
PI Design for 3DIC implementaion:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
10
Optimal Channel Design for Die-to-Die Interface in Multi-di..:
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2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) ,
11
Simplified Analysis for Silicon Capacitors:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
12
PSI Design Solutions for High Speed Die-to-Die Interface in..:
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2022 IEEE 26th Workshop on Signal and Power Integrity (SPI) ,
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Random Jitter Analysis and Measurement for Reference Clock ..:
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2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) ,
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