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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
2
Aging Behaviour and Environmental Impact of Under Bump Meta..:
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Proceedings of the 2024 International Symposium on Physical Design ,
7
Warpage Study by Employing an Advanced Simulation Methodolo..:
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2024 IEEE International Reliability Physics Symposium (IRPS) ,
8
Electromigration Test Chip Experiments from Realistic Power..:
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Proceedings of the 2023 International Symposium on Physical Design ,
12