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Murugan, Rajen
18  results:
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1

System-Level Reliability Case Studies of High-Performance A..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Jiang, Li ; Li, Guangxu ; Zeng, Kejun.. - p. 828-833 , 2023
Link: https://doi.org/10.1109/..
 
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2

Signal Integrity Co-Design of a High-Speed (20 Gbps) Analog..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Manian, Srikanth ; Shanmuganarayanan, S ; Murugan, Rajen. - p. 1017-1021 , 2023
Link: https://doi.org/10.1109/..
 
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3

CISPR 25 Conducted Emission Simulation and Measurement Corr..:

, In: 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Chen, Jie ; Murugan, Rajen ; Broze, John... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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4

A Novel Approach to Measure and Characterize Radiation Patt..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Jogalekar, Aditya N. ; Medina, Oscar F. ; Iyer, Mahadevan K.... - p. 498-503 , 2023
Link: https://doi.org/10.1109/..
 
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5

Multiscale EMC Modeling, Simulation, and Validation of a Sy..:

Murugan, Rajen ; Chen, Jie ; Tripathi, Ambreesh...
IEEE Journal on Multiscale and Multiphysics Computational Techniques.  8 (2023)  - p. 269-280 , 2023
Link: https://doi.org/10.1109/..
 
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6

Filler Particle Distribution Impact for Interfacial Delamin..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Suzuki, Yutaka ; Jiang, Li ; Jaimal, Williamson. - p. 187-191 , 2023
Link: https://doi.org/10.1109/..
 
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7

Bulk Current Injection (BCI) Simulation and Measurement Cor..:

, In: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS),
Chen, Jie ; Murugan, Rajen ; Ravinuthula, Vishnu... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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8

CISPR 25 Radiated Emission Simulation and Measurement Corre..:

, In: 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Chen, Jie ; Murugan, Rajen ; Saw, Sooping... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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9

Slot Bow-Tie Antenna Integration in Flip-Chip and Embedded ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Jogalekar, Aditya N. ; Medina, Oscar F. ; Blanchard, Andrew... - p. 371-376 , 2022
Link: https://doi.org/10.1109/..
 
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10

Methods to Characterize Radiation Patterns of WR5 Band Inte..:

, In: 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Jogalekar, Aditya N. ; Medina, Oscar F. ; Blanchard, Andrew... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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11

A New Current Crowding Phenomenon for Flip-Chip-on-Leadfram..:

, In: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS),
Ankamah-Kusi, Sylvester ; Sreenivasan, Koduri ; Murugan, Rajen - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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12

Improvement of Radiation Characteristics of a 300-GHz On-Ch..:

, In: 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Bakshi, Harshpreet S. ; Murugan, Rajen ; Ankamah-Kusi, Sylvester - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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13

Slot Bow-Tie Antenna Integration in an Enhanced Flip-Chip Q..:

, In: 2021 IEEE MTT-S International Microwave and RF Conference (IMARC),
Jogalekar, Aditya N. ; Medina, Oscar F. ; Blanchard, Andrew... - p. 1-4 , 2021
Link: https://doi.org/10.1109/..
 
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14

Die-Package-PCB Signal Integrity Performance Debug of a Hig..:

, In: 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI),
Tang, Tony ; Wray, Bridger ; Murugan, Rajen - p. 170-175 , 2020
Link: https://doi.org/10.1109/..
 
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15

Co-Design of a Highly Integrated, High Peformance, 16-Chann..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Jain, Prashuk ; Chen, Jie ; Murugan, Rajen... - p. 1390-1395 , 2020
Link: https://doi.org/10.1109/..
 
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