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2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference & Compatibility (APEMC/INCEMIC) ,
4
Demystifying the Influence of Channel Components on Signal ..:
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2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ,
9
Thermal Sensitivity of Dielectric Materials in High-Speed D..:
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2019 Electrical Design of Advanced Packaging and Systems (EDAPS) ,
12