Search for persons
X
?
2022 International Conference on Electronics Packaging (ICEP) ,
1
Low-Temperature Chemical Vapor Deposition of SiCN for Hybri..:
, In:
?
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
2
Direct Bonding Using Low Temperature SiCN Dielectrics:
, In:
?
2017 IEEE International Interconnect Technology Conference (IITC) ,
4