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Low-Temperature Chemical Vapor Deposition of SiCN for Hybri..:

, In: 2022 International Conference on Electronics Packaging (ICEP),

Onishi, Koki ; Iwata, Tomoya ; Habuka, Hitoshi.. - p. 59-60 , 2022

Link: https://doi.org/10.23919..

2

Direct Bonding Using Low Temperature SiCN Dielectrics:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),

Iacovo, Serena ; Nagano, Fuya ; Channam, Venkat Sunil Kumar... - p. 602-607 , 2022

Link: https://doi.org/10.1109/..

3

Characterization of Silicon Carbon Nitride for Low Temperat..:

Nagano, Fuya ; Iacovo, Serena ; Phommahaxay, Alain...
ECS Transactions. 98 (2020) 4 - p. 21-31 , 2020

Link: https://doi.org/10.1149/..

4

Growth rate of IMC in the binary sytems of Co/Sn and Cu/Sn:

, In: 2017 IEEE International Interconnect Technology Conference (IITC),

Nagano, Fuya ; Kajihara, Masanori ; Derakhshandeh, Jaber... - p. 1-3 , 2017

Link: https://doi.org/10.1109/..

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