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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
1
Study on Enhancing Flip-Chip-Chip Scale Package (FCCSP) Rel..:
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2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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Automated Defect Classification In Semiconductor Devices Us..:
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2023 IEEE Power & Energy Society General Meeting (PESGM) ,
7
A Hierarchical Control Architecture: Utilization of Behind-..:
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2023 2nd International Conference on Multidisciplinary Engineering and Applied Science (ICMEAS) ,
8
Recent Advances in the Synthesis of Biobased Epoxy Polymer:..:
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Lecture Notes in Networks and Systems; Next Generation Systems and Networks ,
11