Nair, Arya Sukumaran
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1

Study on Enhancing Flip-Chip-Chip Scale Package (FCCSP) Rel..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
 
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2

Automated Defect Classification In Semiconductor Devices Us..:

, In: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
 
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6

Determinants of substance use among young people attending ..:

Venkatesh, U. ; Aparnavi, P. ; Mogan, K.A....
Cambridge Prisms: Global Mental Health.  11 (2024)  - p. , 2024
 
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7

A Hierarchical Control Architecture: Utilization of Behind-..:

, In: 2023 IEEE Power & Energy Society General Meeting (PESGM),
 
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8

Recent Advances in the Synthesis of Biobased Epoxy Polymer:..:

, In: 2023 2nd International Conference on Multidisciplinary Engineering and Applied Science (ICMEAS),
 
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11

CLAMP: Criticality Aware Coherency Protocol for Locked Mult..:

, In: Lecture Notes in Networks and Systems; Next Generation Systems and Networks,
 
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