Nakayama, Kohei
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1

Minimizing Recess of Cu Pad on Hybrid Bonding with SiCN via..:

Nakayama, Kohei ; Hayama, Kenta ; Tanaka, Fabiana Lie..
ECS Journal of Solid State Science and Technology.  13 (2024)  7 - p. 074009 , 2024
 
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2

Surface Topography Control on Cu Pad for Hybrid Bonding:

, In: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM),
Nakayama, Kohei ; Iwata, Tomoya ; Ebiko, Sodai... - p. 1-3 , 2023
 
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5

Superconducting Narrowband Filter for Receiver of Weather R..:

KAWAGUCHI, Tamio ; SHIOKAWA, Noritsugu ; NAKAYAMA, Kohei...
IEICE Transactions on Electronics.  E92-C (2009)  3 - p. 296-301 , 2009
 
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6

Development of multilayer process with upper wiring layer f..:

Ishimaru, Yoshihiro ; Ogura, Makoto ; Horibe, Osami...
Physica C: Superconductivity and its Applications.  445-448 (2006)  - p. 908-911 , 2006
 
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10

Electrical Properties of Single Crystalline CeO2High-k Gate..:

Nishikawa, Yukie ; Fukushima, Noburu ; Yasuda, Naoki..
Japanese Journal of Applied Physics.  41 (2002)  Part 1, No. 4B - p. 2480-2483 , 2002
 
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15

Catheter-related bloodstream infection caused by Lacticasei..:

Fukuda, Yuto ; Morioka, Hiroshi ; Yamamoto, Shuta...
Journal of Infection and Chemotherapy.  30 (2024)  7 - p. 664-667 , 2024
 
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