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Nam, Seungki
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1

Effective Interface Simulation Approach Based on Peak Disto..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Kim, Joonhyun ; Nam, Seungki ; Moon, Sungwook... - p. 1104-1107 , 2024
Link: https://doi.org/10.1109/..
 
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2

Statistical Analysis of Off-chip Power-Integrity for Multic..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Han, Sodam ; Moon, Sungwook ; Son, Jungil. - p. 991-995 , 2023
Link: https://doi.org/10.1109/..
 
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3

Experimental Method for Measuring the Jitter Sensitivity Fu..:

, In: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI),
Kim, Joonhyun ; Lee, Seonha ; Nam, Seungki.. - p. 668-668 , 2023
Link: https://doi.org/10.1109/..
 
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4

PI Design for 3DIC implementaion:

, In: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI),
Moon, Sungwook ; Kang, Minsuk ; Ahn, Duhyoung. - p. 669-669 , 2023
Link: https://doi.org/10.1109/..
 
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5

Simplified Analysis for Silicon Capacitors:

, In: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI),
Son, Jungil ; Ku, Kunwoo ; Nam, Seungki.. - p. 682-682 , 2023
Link: https://doi.org/10.1109/..
 
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6

Optimal Channel Design for Die-to-Die Interface in Multi-di..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Park, Jiyoung ; Nam, Seungki ; Moon, Sungwook. - p. 1509-1513 , 2023
Link: https://doi.org/10.1109/..
 
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7

PSI Design Solutions for High Speed Die-to-Die Interface in..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Kim, Taeyun ; Moon, Sungwook ; Jo, Chanmin.. - p. 2158-2162 , 2022
Link: https://doi.org/10.1109/..
 
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8

Chiplet-based System PSI Optimization for 2.5D/3D Advanced ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Hwang, Yoonjae ; Moon, Sungwook ; Nam, Seungki. - p. 12-17 , 2022
Link: https://doi.org/10.1109/..
 
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9

Simplified Modeling Approach for Extracting Bump Current Pr..:

, In: 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI),
Yoo, Raewoon ; Moon, Sungwook ; Park, Jiyoung. - p. 336-336 , 2022
Link: https://doi.org/10.1109/..
 
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10

Fast Channel Analysis and Design Approach using Deep Learni..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Han, Sodam ; Moon, Sungwook ; Nam, Seungki... - p. 1337-1341 , 2022
Link: https://doi.org/10.1109/..
 
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11

System-level Power Integrity Optimization Based on High-Den..:

, In: 2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Moon, Sungwook ; Nam, Seungki ; Son, Jungil. - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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12

Electrical modeling of ball grid array packages based on on..:

Nam, Seungki ; Lee, Jaehoon ; Kim, Yonggyoo...
Current Applied Physics.  5 (2005)  3 - p. 271-276 , 2005
Link: https://doi.org/10.1016/..
 
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13

Contents of paeoniflorin and albiflorin in two Korean landr..:

Lee, Seungki ; Park, Nam-Il ; Park, Yeri...
Genes & Genomics.  , 2024
Link: https://doi.org/10.1007/..
 
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14

3D-Printed functionally graded thermoelectric materials for..:

Han, Hyunjin ; Eun Yang, Seong ; Lee, Jungsoo...
Chemical Engineering Journal.  497 (2024)  - p. 154547 , 2024
Link: https://doi.org/10.1016/..
 
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15

Microfluidic chip with integrated separation, mixing, and c..:

Nam, Young-Ho ; Lee, Sin ; Lee, Seung-Ki..
Sensors and Actuators B: Chemical.  404 (2024)  - p. 135202 , 2024
Link: https://doi.org/10.1016/..
 
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