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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Quantifying the Electrical Impact of Bonding Misalignment f..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
2
Modeling of Copper Hybrid Bonding Anneal:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
3
Impact of Plasma Activation on Copper Surface Layer for Low..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
4
0.5 μm Pitch Next Generation Hybrid Bonding with High Align..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Wet Atomic Layer Etching of Copper Structures for Highly Sc..:
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2020 IEEE International Interconnect Technology Conference (IITC) ,
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Improving Ruthenium Polishing Through the use of Ceria Abra..:
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Joint Urban Remote Sensing Event 2013 ,
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