Netzband, Christopher
14  results:
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1

Quantifying the Electrical Impact of Bonding Misalignment f..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Ryan, Kevin ; Ip, Nathan ; Netzband, Christopher... - p. 1329-1334 , 2024
 
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2

Modeling of Copper Hybrid Bonding Anneal:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Hooge, Joshua ; Jois, Chetan ; Netzband, Christopher. - p. 1231-1235 , 2024
 
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3

Impact of Plasma Activation on Copper Surface Layer for Low..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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4

0.5 μm Pitch Next Generation Hybrid Bonding with High Align..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Netzband, Christopher ; Ryan, Kevin ; Mimura, Yuji... - p. 1100-1104 , 2023
 
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5

Wet Atomic Layer Etching of Copper Structures for Highly Sc..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
 
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6

Improving Ruthenium Polishing Through the use of Ceria Abra..:

, In: 2020 IEEE International Interconnect Technology Conference (IITC),
 
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8

Deposition of hermetic silver shells onto copper flakes:

Njagi, John I. ; Netzband, Christopher M. ; Goia, Dan V.
Journal of Colloid and Interface Science.  488 (2017)  - p. 72-78 , 2017
 
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