Ng, Hun Shen
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2

Advanced analysis on board trace reliability of WLCSP under..:

Syed, Ahmer ; Tee, Tong Yan ; Ng, Hun Shen...
Microelectronics Reliability.  50 (2010)  7 - p. 928-936 , 2010
 
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3

Impact of Thermal, Moisture, and Mechanical Loading Conditi..:

Loo, Shane ; Zhang, Xueren ; Ng, Hun Shen..
Journal of Electronic Materials.  36 (2007)  2 - p. 110-116 , 2007
 
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5

Impact life prediction modeling of TFBGA packages under boa..:

Tee, Tong Yan ; Ng, Hun Shen ; Lim, Chwee Teck..
Microelectronics Reliability.  44 (2004)  7 - p. 1131-1142 , 2004
 
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6

Board level solder joint reliability modeling and testing o..:

Tee, Tong Yan ; Ng, Hun Shen ; Yap, Daniel..
Microelectronics Reliability.  43 (2003)  7 - p. 1117-1123 , 2003
 
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7

Comprehensive board-level solder joint reliability modeling..:

Tee, Tong Yan ; Ng, Hun Shen ; Yap, Daniel.
Microelectronics Reliability.  43 (2003)  8 - p. 1329-1338 , 2003
 
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8

Advanced Analysis of WLCSP Copper Interconnect Reliability ..:

, In: 2008 10th Electronics Packaging Technology Conference,
Tee, Tong Yan ; Long, Bin Tan ; Anderson, Rex... - p. None , 2008
 
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10

List of Contributors:

, In: Human Stem Cell Manual,
Ährlund-Richter, Lars ; Altun, Gulsah ; Asaka, Isao... - p. xxv-xxxi , 2012
 
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12

Endoscopic Transorbital Approach to the Optic Canal and Orb..:

, In: Orbital Apex and Periorbital Skull Base Diseases,
Ng, Ben ; Park, Hun Ho ; MAK, Calvin - p. 223-228 , 2023
 
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13

Formulation, mechanical properties and phase analysis of fl..:

Hui-Teng, Ng ; Cheng-Yong, Heah ; Yun-Ming, Liew...
Journal of Materials Research and Technology.  12 (2021)  - p. 1212-1226 , 2021
 
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