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Nguyen, Vu-Hoang
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1

Person re-identification with mutual re-ranking:

Nguyen, Ngoc-Bao ; Nguyen, Vu-Hoang ; Ngo, Thanh Duc.
Vietnam Journal of Computer Science.  4 (2017)  4 - p. 233-244 , 2017
Link: https://doi.org/10.1007/..
 
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2

ERI-MAC: An Energy-Harvested Receiver-Initiated MAC Protoco..:

Nguyen, Kien ; Nguyen, Vu-Hoang ; Le, Duy-Dinh...
International Journal of Distributed Sensor Networks.  10 (2014)  5 - p. 514169 , 2014
Link: https://doi.org/10.1155/..
 
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3

Wafer Level Capping Technology for Vacuum Packaging of Micr..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Zoschke, Kai ; Manier, Charles Alix ; Oppermann, Hermann... - p. 1571-1578 , 2023
Link: https://doi.org/10.1109/..
 
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4

Encapsulation of Biosensor for Stress Monitoring in Fish: A..:

, In: 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac),
Brathen, Hanna T. ; Barskrind, Steffen ; Kolstad, Anne Line Fredsvik.. - p. 1-5 , 2023
Link: https://doi.org/10.23919..
 
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5

Low-Temperature Cu–(Sn–Bi) Solid Liquid Interdiffusion Bond..:

, In: 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac),
Gonzalez, Lisette Hernandez ; Aasmundveit, Knut E. ; Nguyen, Hoang-Vu - p. 1-4 , 2023
Link: https://doi.org/10.23919..
 
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6

Black Silicon as Anti-Reflective Structure for Infrared Ima..:

Bardalen, Eivind ; Bouchouri, Angelos ; Akram, Muhammad Nadeem.
Nanomaterials.  14 (2023)  1 - p. 20 , 2023
Link: https://doi.org/10.3390/..
 
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7

Ag–(In–Bi) solid-state bonding:

Kuziora, Stéphane Léonard ; Nguyen, Hoang-Vu ; Aasmundtveit, Knut Eilif
Journal of Materials Science: Materials in Electronics.  34 (2023)  16 - p. , 2023
Link: https://doi.org/10.1007/..
 
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8

Flip-Chip Interconnects Based on Single Metal-Coated Polyme..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Huynh, Van Long ; Aasmundtveit, Knut E. ; Nguyen, Hoang-Vu - p. 1-5 , 2023
Link: https://doi.org/10.23919..
 
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9

Thermal Conductivity and Mechanical Properties of Polymer C..:

Do, Nu Bich Duyen ; Imenes, Kristin ; Aasmundtveit, Knut E...
Polymers.  15 (2023)  6 - p. 1552 , 2023
Link: https://doi.org/10.3390/..
 
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10

Investigate the Frequency Effect to the Deformation and Vib..:

, In: 2023 8th International Scientific Conference on Applying New Technology in Green Buildings (ATiGB),
Do, Chi-Phi ; Doan, Thanh-Bao ; Le, Dinh-Kha. - p. 136-141 , 2023
Link: https://doi.org/10.1109/..
 
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11

Assembly of Ultra-Thin MEMS Device on Driver Chip Using Ani..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Nguyen, Hoang-Vu ; Aasmundtveit, Knut Eilif - p. 1-5 , 2023
Link: https://doi.org/10.23919..
 
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12

Thermally Conductive Polymer Composites with Hexagonal Boro..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Duyen Do, Nu Bich ; Imenes, Kristin ; Aasmundtveit, Knut E... - p. 1-8 , 2023
Link: https://doi.org/10.23919..
 
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13

Au-(In-Bi) and Ag-(In-Bi) Metallic Bonding for Temperature ..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Nguyen, Hoang-Vu ; Kuziora, Stephane Leonard ; Aasmundtveit, Knut E. - p. 373-378 , 2022
Link: https://doi.org/10.1109/..
 
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14

Selective Deposition of Conductive Particles for Anisotropi..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Huynh, Van Long ; Aasmundtveit, Knut Eilif ; Nguyen, Hoang-Vu - p. 124-128 , 2022
Link: https://doi.org/10.1109/..
 
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15

Design of Silicon Cap for Hermetic Packaging of Microbolome..:

Xia, Hexin ; Akram, Muhammad Nadeem ; Roy, Avisek...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  12 (2022)  3 - p. 429-436 , 2022
Link: https://doi.org/10.1109/..
 
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