Nicolas, Stéphane D.
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1

3-layer Fine Pitch Cu-Cu Hybrid Bonding Demonstrator With H..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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5

Low Resistance and High Isolation HD TSV for 3-Layer CMOS I..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Borel, Stephan ; Assous, Myriam ; Velard, Remi... - p. 771-777 , 2024
 
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6

Demonstration of a Wafer Level Face- To-Back (F2B) Fine Pit..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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10

Image Retrieval and Pattern Spotting on Historical Document..:

, In: 2022 26th International Conference on Pattern Recognition (ICPR),
 
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11

Advanced 3d Design and Technologies for 3-Layer Smart Image:

, In: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
 
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