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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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3-layer Fine Pitch Cu-Cu Hybrid Bonding Demonstrator With H..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
5
Low Resistance and High Isolation HD TSV for 3-Layer CMOS I..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
6
Demonstration of a Wafer Level Face- To-Back (F2B) Fine Pit..:
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2022 26th International Conference on Pattern Recognition (ICPR) ,
10
Image Retrieval and Pattern Spotting on Historical Document..:
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2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) ,
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