Nishimura, Tetsuro
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4

Lead-Free Diffusion Bonding for High Temperature Using ZnAl..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
 
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7

Controlling Pore Position during Transient Liquid Phase Bon..:

Razak, N. R. Abdul ; Tan, Xin F. ; McDonald, Stuart D....
Transactions of The Japan Institute of Electronics Packaging.  17 (2024)  0 - p. E23-009-1-E23-009-9 , 2024
 
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13

Combined computed tomography and C-arm resuscitation room s..:

Uchida, Kenichiro ; Deguchi, Ryo ; Himura, Hoshi...
Trauma Surgery & Acute Care Open.  8 (2023)  1 - p. e001153 , 2023
 
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