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Nistala, Ramesh Rao
40  results:
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1

Case Study of SIMS Analysis on Insulators:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Wang, Yun ; Ong, Kian Kok ; Teo, Han Wei... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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2

Influence of RF Power on Crystal Formation in Ionized Metal..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Zhu, Xintong ; Roslan, Amirul Afiq Hamizan M ; Xie, Jun... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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3

Impact of High Temperature Storage for Prolonged Duration o..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Zhu, Xintong ; Rajoo, Ranjan ; Yip, Kim Hong... - p. 1030-1036 , 2023
Link: https://doi.org/10.1109/..
 
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4

Cs+ Reactive Sputter Depth Profile for Ultrathin Metal/Meta..:

, In: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Teo, Han Wei ; Wang, Yun ; Ong, Kenny.. - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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5

Comparison of Mechanical Properties of Nickel-Palladium Pla..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Zhu, Xintong ; Rajoo, Ranjan ; Nistala, Ramesh Rao. - p. 753-758 , 2022
Link: https://doi.org/10.1109/..
 
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6

Interfacial Adhesion Strength of Group IV-VI Thin Film Depo..:

, In: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Zhu, Xintong ; Nistala, Ramesh Rao ; Qiang Mo, Zhi - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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7

Multi-layered film stack models to simulate X-ray reflectiv..:

, In: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Nistala, Ramesh Rao ; Ong, Kenny ; Wang, Yun.. - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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8

4-Point-Bending Characterization of Interfacial Adhesion St..:

, In: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA),
Zhu, Xintong ; Li, Xiaoxuan ; Nistala, Ramesh Rao... - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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9

Application of Nano-indentation method to characterize adhe..:

, In: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA),
LI, Xiaoxuan ; ZHU, Xintong ; LIU, Yi... - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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10

Application of SIMS for the characterization of Nitrogen in..:

, In: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA),
Wang, Yun ; Teo, Han Wei ; Ong, Kian Kok... - p. 1-3 , 2019
Link: https://doi.org/10.1109/..
 
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11

Case Study on Precise Boron Quantification of Mixed Matrix:

, In: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA),
Ong, Kian Kok ; Wang, Yun ; Teo, Han Wei.. - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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12

A High Performance Miniaturized 25 GHz Band Pass Filter Usi..:

, In: 2024 7th International Conference on Electronics, Communications, and Control Engineering (ICECC),
Machavaram, Venkata Raghunadh ; Nistala, Bheema Rao - p. 60-65 , 2024
Link: https://doi.org/10.1109/..
 
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13

A 16Gbps 3rd Order CTLE Design for Serial Links with High C..:

, In: 2023 36th International Conference on VLSI Design and 2023 22nd International Conference on Embedded Systems (VLSID),
Thota, Pranay Kumar ; Rapina, Siva Kumar ; Nistala, Bheema Rao - p. 284-289 , 2023
Link: https://doi.org/10.1109/..
 
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14

Circuit Level Analysis of a Dual Material Graded Channel (D..:

Mudidhe, Praveen Kumar ; Nistala, Bheema Rao
ECS Journal of Solid State Science and Technology.  12 (2023)  6 - p. 063002 , 2023
Link: https://doi.org/10.1149/..
 
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15

Temperature Analysis of DMGC CGAA FET for Future Deep Space..:

Mudidhe, Praveen Kumar ; Nistala, Bheema Rao
ECS Journal of Solid State Science and Technology.  12 (2023)  8 - p. 083005 , 2023
Link: https://doi.org/10.1149/..
 
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