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2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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Case Study of SIMS Analysis on Insulators:
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2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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Influence of RF Power on Crystal Formation in Ionized Metal..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
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Impact of High Temperature Storage for Prolonged Duration o..:
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2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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Cs+ Reactive Sputter Depth Profile for Ultrathin Metal/Meta..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
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Comparison of Mechanical Properties of Nickel-Palladium Pla..:
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2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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Interfacial Adhesion Strength of Group IV-VI Thin Film Depo..:
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2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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Multi-layered film stack models to simulate X-ray reflectiv..:
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2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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4-Point-Bending Characterization of Interfacial Adhesion St..:
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2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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Application of Nano-indentation method to characterize adhe..:
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2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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Application of SIMS for the characterization of Nitrogen in..:
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2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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Case Study on Precise Boron Quantification of Mixed Matrix:
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2024 7th International Conference on Electronics, Communications, and Control Engineering (ICECC) ,
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A High Performance Miniaturized 25 GHz Band Pass Filter Usi..:
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2023 36th International Conference on VLSI Design and 2023 22nd International Conference on Embedded Systems (VLSID) ,
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